Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow front shape is highly non-uniform around the die stack-up units and is dependent on various design parame...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sung-won Moon, Cheng Yang, Zhihua Li, Fischer, A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Design optimization Electronics packaging Encapsulation Equations Filling Injection molding Performance analysis Process design Solid modeling Viscosity
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