6E-1 A Small-Sized SAW Duplexer on a SiO2/IDT/LiNbO3 Structure for Wideband CDMA Application
A small-sized SAW duplexer for Wideband CDMA (W-CDMA) application at 2 GHz band has been developed. The W-CDMA application has a wide duplex gap between transmitting (Tx) band and receiving (Rx) band. To realize a small-sized SAW duplexer, a substrate with high electromechanical coupling coefficient...
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creator | Nakamura, H. Nakanishi, H. Tsurunari, T. Matsunami, K. Iwasaki, Y. |
description | A small-sized SAW duplexer for Wideband CDMA (W-CDMA) application at 2 GHz band has been developed. The W-CDMA application has a wide duplex gap between transmitting (Tx) band and receiving (Rx) band. To realize a small-sized SAW duplexer, a substrate with high electromechanical coupling coefficient (K2) and small temperature coefficient of frequency (TCF) is needed. Our W-CDMA SAW duplexer was fabricated on a SiO 2 /IDT/5degYX-LiNbO 3 structure. Using this structure, an appropriate high K2 and small TCF could be achieved, but the spurious caused by Rayleigh-mode would occur. This spurious appears at lower side than the resonance frequency of SAW resonator, and degrades performances of the duplexer. We have successfully developed the technique to suppress the spurious by controlling a shape of SiO 2 film on IDT electrodes. And, the spurious dependences of IDT designs, pitch and metallization ratio, were cleared. The spurious suppression technique has been applied to the W- CDMA SAW duplexer. The duplexer has excellent performance of low insertion loss, high attenuation and small TCF. The Tx and Rx insertion loss are 1.2 dB and 1.9 dB, respectively. The size of the duplexer could be miniaturized to 2.5times2.0 mm 2 . Additionally, the duplexer has sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti. These techniques could be applied to the other wide-band SAW applications for realizing good performances. |
doi_str_mv | 10.1109/ULTSYM.2007.131 |
format | Conference Proceeding |
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The W-CDMA application has a wide duplex gap between transmitting (Tx) band and receiving (Rx) band. To realize a small-sized SAW duplexer, a substrate with high electromechanical coupling coefficient (K2) and small temperature coefficient of frequency (TCF) is needed. Our W-CDMA SAW duplexer was fabricated on a SiO 2 /IDT/5degYX-LiNbO 3 structure. Using this structure, an appropriate high K2 and small TCF could be achieved, but the spurious caused by Rayleigh-mode would occur. This spurious appears at lower side than the resonance frequency of SAW resonator, and degrades performances of the duplexer. We have successfully developed the technique to suppress the spurious by controlling a shape of SiO 2 film on IDT electrodes. And, the spurious dependences of IDT designs, pitch and metallization ratio, were cleared. The spurious suppression technique has been applied to the W- CDMA SAW duplexer. The duplexer has excellent performance of low insertion loss, high attenuation and small TCF. The Tx and Rx insertion loss are 1.2 dB and 1.9 dB, respectively. The size of the duplexer could be miniaturized to 2.5times2.0 mm 2 . Additionally, the duplexer has sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti. 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The W-CDMA application has a wide duplex gap between transmitting (Tx) band and receiving (Rx) band. To realize a small-sized SAW duplexer, a substrate with high electromechanical coupling coefficient (K2) and small temperature coefficient of frequency (TCF) is needed. Our W-CDMA SAW duplexer was fabricated on a SiO 2 /IDT/5degYX-LiNbO 3 structure. Using this structure, an appropriate high K2 and small TCF could be achieved, but the spurious caused by Rayleigh-mode would occur. This spurious appears at lower side than the resonance frequency of SAW resonator, and degrades performances of the duplexer. We have successfully developed the technique to suppress the spurious by controlling a shape of SiO 2 film on IDT electrodes. And, the spurious dependences of IDT designs, pitch and metallization ratio, were cleared. The spurious suppression technique has been applied to the W- CDMA SAW duplexer. The duplexer has excellent performance of low insertion loss, high attenuation and small TCF. The Tx and Rx insertion loss are 1.2 dB and 1.9 dB, respectively. The size of the duplexer could be miniaturized to 2.5times2.0 mm 2 . Additionally, the duplexer has sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti. These techniques could be applied to the other wide-band SAW applications for realizing good performances.</description><subject>Electrodes</subject><subject>Frequency</subject><subject>Insertion loss</subject><subject>Multiaccess communication</subject><subject>Resonance</subject><subject>Shape control</subject><subject>Substrates</subject><subject>Surface acoustic waves</subject><subject>Temperature</subject><subject>Wideband</subject><issn>1051-0117</issn><isbn>9781424413836</isbn><isbn>1424413834</isbn><isbn>9781424413843</isbn><isbn>1424413842</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVzEFLwzAYgOGICs65swcv-QNdvy9Jk_RYuk0HnTt0YwjCSJMUIl1b2g3UX-9BL55enstLyCPCHBHSeF_syrfNnAGoOXK8IrNUaRRMCORa8Ot_5vKGTBASjABR3ZH7cfwAYJAwMSHvchkhzWh5Mk0TleHbO1pmB7q49I3_9APtWmpoGbYsXi92cRFeqy2n5Xm42PNl8LTuBnoIzlemdTRfbDKa9X0TrDmHrn0gt7VpRj_765TsV8td_hIV2-d1nhWRRc5YZFXCea1txazGiiktXaKk8JhIIwFTqbQDAc44aSxWFsGr2kmlnGc6cYpPydPvN3jvj_0QTmb4OgoBqQLBfwDLxVH2</recordid><startdate>200710</startdate><enddate>200710</enddate><creator>Nakamura, H.</creator><creator>Nakanishi, H.</creator><creator>Tsurunari, T.</creator><creator>Matsunami, K.</creator><creator>Iwasaki, Y.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200710</creationdate><title>6E-1 A Small-Sized SAW Duplexer on a SiO2/IDT/LiNbO3 Structure for Wideband CDMA Application</title><author>Nakamura, H. ; Nakanishi, H. ; Tsurunari, T. ; Matsunami, K. ; Iwasaki, Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1322-c7533f8cb2c81b2786d5764e156a6019678d040dad6ac1bc10e7fd677de285d73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng ; jpn</language><creationdate>2007</creationdate><topic>Electrodes</topic><topic>Frequency</topic><topic>Insertion loss</topic><topic>Multiaccess communication</topic><topic>Resonance</topic><topic>Shape control</topic><topic>Substrates</topic><topic>Surface acoustic waves</topic><topic>Temperature</topic><topic>Wideband</topic><toplevel>online_resources</toplevel><creatorcontrib>Nakamura, H.</creatorcontrib><creatorcontrib>Nakanishi, H.</creatorcontrib><creatorcontrib>Tsurunari, T.</creatorcontrib><creatorcontrib>Matsunami, K.</creatorcontrib><creatorcontrib>Iwasaki, Y.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nakamura, H.</au><au>Nakanishi, H.</au><au>Tsurunari, T.</au><au>Matsunami, K.</au><au>Iwasaki, Y.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>6E-1 A Small-Sized SAW Duplexer on a SiO2/IDT/LiNbO3 Structure for Wideband CDMA Application</atitle><btitle>2007 IEEE Ultrasonics Symposium Proceedings</btitle><stitle>ULTSYM</stitle><date>2007-10</date><risdate>2007</risdate><spage>488</spage><epage>491</epage><pages>488-491</pages><issn>1051-0117</issn><isbn>9781424413836</isbn><isbn>1424413834</isbn><eisbn>9781424413843</eisbn><eisbn>1424413842</eisbn><abstract>A small-sized SAW duplexer for Wideband CDMA (W-CDMA) application at 2 GHz band has been developed. The W-CDMA application has a wide duplex gap between transmitting (Tx) band and receiving (Rx) band. To realize a small-sized SAW duplexer, a substrate with high electromechanical coupling coefficient (K2) and small temperature coefficient of frequency (TCF) is needed. Our W-CDMA SAW duplexer was fabricated on a SiO 2 /IDT/5degYX-LiNbO 3 structure. Using this structure, an appropriate high K2 and small TCF could be achieved, but the spurious caused by Rayleigh-mode would occur. This spurious appears at lower side than the resonance frequency of SAW resonator, and degrades performances of the duplexer. We have successfully developed the technique to suppress the spurious by controlling a shape of SiO 2 film on IDT electrodes. And, the spurious dependences of IDT designs, pitch and metallization ratio, were cleared. The spurious suppression technique has been applied to the W- CDMA SAW duplexer. The duplexer has excellent performance of low insertion loss, high attenuation and small TCF. The Tx and Rx insertion loss are 1.2 dB and 1.9 dB, respectively. The size of the duplexer could be miniaturized to 2.5times2.0 mm 2 . Additionally, the duplexer has sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti. These techniques could be applied to the other wide-band SAW applications for realizing good performances.</abstract><pub>IEEE</pub><doi>10.1109/ULTSYM.2007.131</doi><tpages>4</tpages></addata></record> |
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subjects | Electrodes Frequency Insertion loss Multiaccess communication Resonance Shape control Substrates Surface acoustic waves Temperature Wideband |
title | 6E-1 A Small-Sized SAW Duplexer on a SiO2/IDT/LiNbO3 Structure for Wideband CDMA Application |
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