Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory

Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Payandehjoo, K., Kostka, D., Abhari, R.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 274
container_issue
container_start_page 271
container_title
container_volume
creator Payandehjoo, K.
Kostka, D.
Abhari, R.
description Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.
doi_str_mv 10.1109/EPEP.2007.4387179
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4387179</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4387179</ieee_id><sourcerecordid>4387179</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-2edb6453d6ec59eb54596e58a0b6462f46f3bc2f5cc17370df0f2d84d97304953</originalsourceid><addsrcrecordid>eNotkN1KwzAAhQMqOOceQLzJC7TmP83lmHUKVXvRXY-2STTaJZK0jL69E3duDnwcvosDwB1GOcZIPZR1WecEIZkzWkgs1QW4wYwwhoqCokuwIFjwjGEkr8EqpS90ClWMCrEAu7Vvhzm5BIOFdTiaCB9dGqPrptEFD9_MeAzxO8EpOf8BX6dhdH3weurHEGETW58OLqW_aeW8gc2nCXG-BVe2HZJZnXsJdk9ls3nOqvfty2ZdZQ5LPmbE6E4wTrUwPVem44wrYXjRohMWxDJhadcTy_seSyqRtsgSXTCtJEVMcboE9_9eZ4zZ_0R3aOO8P79AfwHxD1Ib</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Payandehjoo, K. ; Kostka, D. ; Abhari, R.</creator><creatorcontrib>Payandehjoo, K. ; Kostka, D. ; Abhari, R.</creatorcontrib><description>Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.</description><identifier>ISSN: 2165-4107</identifier><identifier>ISBN: 1424408830</identifier><identifier>ISBN: 9781424408832</identifier><identifier>DOI: 10.1109/EPEP.2007.4387179</identifier><language>eng</language><publisher>IEEE</publisher><subject>Circuits ; Conductors ; Crosstalk ; Electromagnetic interference ; Impedance ; Multiconductor transmission lines ; Nonhomogeneous media ; Power systems ; Predictive models ; Solids</subject><ispartof>2007 IEEE Electrical Performance of Electronic Packaging, 2007, p.271-274</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4387179$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27904,54898</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4387179$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Payandehjoo, K.</creatorcontrib><creatorcontrib>Kostka, D.</creatorcontrib><creatorcontrib>Abhari, R.</creatorcontrib><title>Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory</title><title>2007 IEEE Electrical Performance of Electronic Packaging</title><addtitle>EPEP</addtitle><description>Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.</description><subject>Circuits</subject><subject>Conductors</subject><subject>Crosstalk</subject><subject>Electromagnetic interference</subject><subject>Impedance</subject><subject>Multiconductor transmission lines</subject><subject>Nonhomogeneous media</subject><subject>Power systems</subject><subject>Predictive models</subject><subject>Solids</subject><issn>2165-4107</issn><isbn>1424408830</isbn><isbn>9781424408832</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkN1KwzAAhQMqOOceQLzJC7TmP83lmHUKVXvRXY-2STTaJZK0jL69E3duDnwcvosDwB1GOcZIPZR1WecEIZkzWkgs1QW4wYwwhoqCokuwIFjwjGEkr8EqpS90ClWMCrEAu7Vvhzm5BIOFdTiaCB9dGqPrptEFD9_MeAzxO8EpOf8BX6dhdH3weurHEGETW58OLqW_aeW8gc2nCXG-BVe2HZJZnXsJdk9ls3nOqvfty2ZdZQ5LPmbE6E4wTrUwPVem44wrYXjRohMWxDJhadcTy_seSyqRtsgSXTCtJEVMcboE9_9eZ4zZ_0R3aOO8P79AfwHxD1Ib</recordid><startdate>200710</startdate><enddate>200710</enddate><creator>Payandehjoo, K.</creator><creator>Kostka, D.</creator><creator>Abhari, R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200710</creationdate><title>Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory</title><author>Payandehjoo, K. ; Kostka, D. ; Abhari, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-2edb6453d6ec59eb54596e58a0b6462f46f3bc2f5cc17370df0f2d84d97304953</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Circuits</topic><topic>Conductors</topic><topic>Crosstalk</topic><topic>Electromagnetic interference</topic><topic>Impedance</topic><topic>Multiconductor transmission lines</topic><topic>Nonhomogeneous media</topic><topic>Power systems</topic><topic>Predictive models</topic><topic>Solids</topic><toplevel>online_resources</toplevel><creatorcontrib>Payandehjoo, K.</creatorcontrib><creatorcontrib>Kostka, D.</creatorcontrib><creatorcontrib>Abhari, R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Payandehjoo, K.</au><au>Kostka, D.</au><au>Abhari, R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory</atitle><btitle>2007 IEEE Electrical Performance of Electronic Packaging</btitle><stitle>EPEP</stitle><date>2007-10</date><risdate>2007</risdate><spage>271</spage><epage>274</epage><pages>271-274</pages><issn>2165-4107</issn><isbn>1424408830</isbn><isbn>9781424408832</isbn><abstract>Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.</abstract><pub>IEEE</pub><doi>10.1109/EPEP.2007.4387179</doi><tpages>4</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 2165-4107
ispartof 2007 IEEE Electrical Performance of Electronic Packaging, 2007, p.271-274
issn 2165-4107
language eng
recordid cdi_ieee_primary_4387179
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Circuits
Conductors
Crosstalk
Electromagnetic interference
Impedance
Multiconductor transmission lines
Nonhomogeneous media
Power systems
Predictive models
Solids
title Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T22%3A28%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Analysis%20of%20Power%20Distribution%20Networks%20using%20Multiconductor%20Transmission%20Line%20Theory&rft.btitle=2007%20IEEE%20Electrical%20Performance%20of%20Electronic%20Packaging&rft.au=Payandehjoo,%20K.&rft.date=2007-10&rft.spage=271&rft.epage=274&rft.pages=271-274&rft.issn=2165-4107&rft.isbn=1424408830&rft.isbn_list=9781424408832&rft_id=info:doi/10.1109/EPEP.2007.4387179&rft_dat=%3Cieee_6IE%3E4387179%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4387179&rfr_iscdi=true