Applied Materials' Product Portfolio and Roadmap
Applied materials played a pivotal role in the commercial acceptance of rapid thermal processing (RTP) within the semiconductor industry, largely by solving the problem of precisely measuring and controlling the temperature of silicon. Today, our RTP-based products are used for processes as varied a...
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creator | Hunter, A. Zelenko, J. Mani, R. |
description | Applied materials played a pivotal role in the commercial acceptance of rapid thermal processing (RTP) within the semiconductor industry, largely by solving the problem of precisely measuring and controlling the temperature of silicon. Today, our RTP-based products are used for processes as varied as radical oxidation, gate oxide engineering, metal silicide annealing, and ultra shallow junction annealing spanning the temperature range from 240degC to over 1200degC. The next generation RTP - millisecond annealing - is following the same trends by providing the most production worthy yet technically capable tool in the world. |
doi_str_mv | 10.1109/RTP.2007.4383813 |
format | Conference Proceeding |
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The next generation RTP - millisecond annealing - is following the same trends by providing the most production worthy yet technically capable tool in the world.</description><subject>Electronics industry</subject><subject>Oxidation</subject><subject>Portfolios</subject><subject>Rapid thermal annealing</subject><subject>Rapid thermal processing</subject><subject>Semiconductor materials</subject><subject>Silicides</subject><subject>Silicon</subject><subject>Temperature control</subject><subject>Temperature distribution</subject><issn>1944-0251</issn><issn>1944-026X</issn><isbn>9781424412273</isbn><isbn>1424412277</isbn><isbn>9781424412280</isbn><isbn>1424412285</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVj0tLAzEUheMLrLV7wc3sXM14k5tMkmUp9QEVh1LBXckTIlMzzIwL_70DFsHVWXyH83EIuaFQUQr6frtrKgYgK44KFcUTstBSUc44p4wpOCUzqjkvgdXvZ_-YxPM_JugluRqGDwChoeYzAsuua1PwxYsZQ59MO9wVTZ_9lxuLJvdjzG3Khfn0xTYbfzDdNbmIUyssjjknbw_r3eqp3Lw-Pq-WmzJRKcayNtyqyY7OTCoGKJXUWjOODn0QXBvmHRPCCqWshBhEtJGhNTFoF7THObn93U0hhH3Xp4Ppv_fH8_gD8ThHog</recordid><startdate>200710</startdate><enddate>200710</enddate><creator>Hunter, A.</creator><creator>Zelenko, J.</creator><creator>Mani, R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200710</creationdate><title>Applied Materials' Product Portfolio and Roadmap</title><author>Hunter, A. ; Zelenko, J. ; Mani, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6a4b84123ca059203787999243c3de549a2dc255b588b70fe5fbf23bafe9ce9d3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Electronics industry</topic><topic>Oxidation</topic><topic>Portfolios</topic><topic>Rapid thermal annealing</topic><topic>Rapid thermal processing</topic><topic>Semiconductor materials</topic><topic>Silicides</topic><topic>Silicon</topic><topic>Temperature control</topic><topic>Temperature distribution</topic><toplevel>online_resources</toplevel><creatorcontrib>Hunter, A.</creatorcontrib><creatorcontrib>Zelenko, J.</creatorcontrib><creatorcontrib>Mani, R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hunter, A.</au><au>Zelenko, J.</au><au>Mani, R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Applied Materials' Product Portfolio and Roadmap</atitle><btitle>2007 15th International Conference on Advanced Thermal Processing of Semiconductors</btitle><stitle>RTP</stitle><date>2007-10</date><risdate>2007</risdate><spage>13</spage><epage>17</epage><pages>13-17</pages><issn>1944-0251</issn><eissn>1944-026X</eissn><isbn>9781424412273</isbn><isbn>1424412277</isbn><eisbn>9781424412280</eisbn><eisbn>1424412285</eisbn><abstract>Applied materials played a pivotal role in the commercial acceptance of rapid thermal processing (RTP) within the semiconductor industry, largely by solving the problem of precisely measuring and controlling the temperature of silicon. Today, our RTP-based products are used for processes as varied as radical oxidation, gate oxide engineering, metal silicide annealing, and ultra shallow junction annealing spanning the temperature range from 240degC to over 1200degC. The next generation RTP - millisecond annealing - is following the same trends by providing the most production worthy yet technically capable tool in the world.</abstract><pub>IEEE</pub><doi>10.1109/RTP.2007.4383813</doi><tpages>5</tpages></addata></record> |
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ispartof | 2007 15th International Conference on Advanced Thermal Processing of Semiconductors, 2007, p.13-17 |
issn | 1944-0251 1944-026X |
language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Electronics industry Oxidation Portfolios Rapid thermal annealing Rapid thermal processing Semiconductor materials Silicides Silicon Temperature control Temperature distribution |
title | Applied Materials' Product Portfolio and Roadmap |
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