Error Tolerance of DNA Self-Healing Assemblies by Puncturing

Error Tolerance of DNA Self-Healing Assemblies by Puncturing

Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hashempour, M., Arani, Z.M., Lombardi, F.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aggregates
Analytical models
Assembly systems
DNA
Error analysis
Error correction
Manufacturing
Redundancy
Self-assembly
Tiles
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 408
container_issue
container_start_page 400
container_title
container_volume
creator Hashempour, M.
Arani, Z.M.
Lombardi, F.
description Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to bind to the aggregate. Punctures can be used for this purpose. The goal of this paper is to characterize an intentionally induced puncture (and its relevant properties) on an erroneous tile site in the assembly. This allows to propagate any newly generated error away from the source of growth (i.e. the seed tile), such that self-assembly can continue along specific directions. Different types of puncture are considered with respect to growth direction, error and aggregate types. Puncture resilience is analyzed using a new characterization metric; different tile sets are investigated in detail. Analytical and simulation results are provided.
doi_str_mv 10.1109/DFT.2007.8
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4358409</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4358409</ieee_id><sourcerecordid>4358409</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-76312f5727b2da3ea81b1e1ad2a347777d3b94f64c0c1fed2436319ba80bbd453</originalsourceid><addsrcrecordid>eNotjDtPwzAURi0eEqF0YWXxH0jw-9oSS9UHRaoAiTBXdnKNgtIE2e3Qf08k-JYzHJ2PkHvOKs6Ze1xt6kowBpW9IIWQACU4Yy7J3IFlYJwW1mp1RQquNSs1gLohtzl_MyaNAlOQp3VKY6L12GPyQ4N0jHT1uqAf2Mdyi77vhi-6yBkPoe8w03Cm76ehOZ7SJO7IdfR9xvk_Z-Rzs66X23L39vyyXOzKjoM-lmAkF1GDgCBaL9FbHjhy3wovFUxrZXAqGtWwhkdshZJT4YK3LIRWaTkjD3-_HSLuf1J38Om8V1JbxZz8BWALR4c</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Error Tolerance of DNA Self-Healing Assemblies by Puncturing</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Hashempour, M. ; Arani, Z.M. ; Lombardi, F.</creator><creatorcontrib>Hashempour, M. ; Arani, Z.M. ; Lombardi, F.</creatorcontrib><description>Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to bind to the aggregate. Punctures can be used for this purpose. The goal of this paper is to characterize an intentionally induced puncture (and its relevant properties) on an erroneous tile site in the assembly. This allows to propagate any newly generated error away from the source of growth (i.e. the seed tile), such that self-assembly can continue along specific directions. Different types of puncture are considered with respect to growth direction, error and aggregate types. Puncture resilience is analyzed using a new characterization metric; different tile sets are investigated in detail. Analytical and simulation results are provided.</description><identifier>ISSN: 1550-5774</identifier><identifier>ISBN: 9780769528854</identifier><identifier>ISBN: 0769528856</identifier><identifier>EISSN: 2377-7966</identifier><identifier>DOI: 10.1109/DFT.2007.8</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aggregates ; Analytical models ; Assembly systems ; DNA ; Error analysis ; Error correction ; Manufacturing ; Redundancy ; Self-assembly ; Tiles</subject><ispartof>22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007), 2007, p.400-408</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4358409$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4358409$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Hashempour, M.</creatorcontrib><creatorcontrib>Arani, Z.M.</creatorcontrib><creatorcontrib>Lombardi, F.</creatorcontrib><title>Error Tolerance of DNA Self-Healing Assemblies by Puncturing</title><title>22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007)</title><addtitle>DFTVS</addtitle><description>Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to bind to the aggregate. Punctures can be used for this purpose. The goal of this paper is to characterize an intentionally induced puncture (and its relevant properties) on an erroneous tile site in the assembly. This allows to propagate any newly generated error away from the source of growth (i.e. the seed tile), such that self-assembly can continue along specific directions. Different types of puncture are considered with respect to growth direction, error and aggregate types. Puncture resilience is analyzed using a new characterization metric; different tile sets are investigated in detail. Analytical and simulation results are provided.</description><subject>Aggregates</subject><subject>Analytical models</subject><subject>Assembly systems</subject><subject>DNA</subject><subject>Error analysis</subject><subject>Error correction</subject><subject>Manufacturing</subject><subject>Redundancy</subject><subject>Self-assembly</subject><subject>Tiles</subject><issn>1550-5774</issn><issn>2377-7966</issn><isbn>9780769528854</isbn><isbn>0769528856</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjDtPwzAURi0eEqF0YWXxH0jw-9oSS9UHRaoAiTBXdnKNgtIE2e3Qf08k-JYzHJ2PkHvOKs6Ze1xt6kowBpW9IIWQACU4Yy7J3IFlYJwW1mp1RQquNSs1gLohtzl_MyaNAlOQp3VKY6L12GPyQ4N0jHT1uqAf2Mdyi77vhi-6yBkPoe8w03Cm76ehOZ7SJO7IdfR9xvk_Z-Rzs66X23L39vyyXOzKjoM-lmAkF1GDgCBaL9FbHjhy3wovFUxrZXAqGtWwhkdshZJT4YK3LIRWaTkjD3-_HSLuf1J38Om8V1JbxZz8BWALR4c</recordid><startdate>200709</startdate><enddate>200709</enddate><creator>Hashempour, M.</creator><creator>Arani, Z.M.</creator><creator>Lombardi, F.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200709</creationdate><title>Error Tolerance of DNA Self-Healing Assemblies by Puncturing</title><author>Hashempour, M. ; Arani, Z.M. ; Lombardi, F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-76312f5727b2da3ea81b1e1ad2a347777d3b94f64c0c1fed2436319ba80bbd453</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Aggregates</topic><topic>Analytical models</topic><topic>Assembly systems</topic><topic>DNA</topic><topic>Error analysis</topic><topic>Error correction</topic><topic>Manufacturing</topic><topic>Redundancy</topic><topic>Self-assembly</topic><topic>Tiles</topic><toplevel>online_resources</toplevel><creatorcontrib>Hashempour, M.</creatorcontrib><creatorcontrib>Arani, Z.M.</creatorcontrib><creatorcontrib>Lombardi, F.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hashempour, M.</au><au>Arani, Z.M.</au><au>Lombardi, F.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Error Tolerance of DNA Self-Healing Assemblies by Puncturing</atitle><btitle>22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007)</btitle><stitle>DFTVS</stitle><date>2007-09</date><risdate>2007</risdate><spage>400</spage><epage>408</epage><pages>400-408</pages><issn>1550-5774</issn><eissn>2377-7966</eissn><isbn>9780769528854</isbn><isbn>0769528856</isbn><abstract>Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to bind to the aggregate. Punctures can be used for this purpose. The goal of this paper is to characterize an intentionally induced puncture (and its relevant properties) on an erroneous tile site in the assembly. This allows to propagate any newly generated error away from the source of growth (i.e. the seed tile), such that self-assembly can continue along specific directions. Different types of puncture are considered with respect to growth direction, error and aggregate types. Puncture resilience is analyzed using a new characterization metric; different tile sets are investigated in detail. Analytical and simulation results are provided.</abstract><pub>IEEE</pub><doi>10.1109/DFT.2007.8</doi><tpages>9</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1550-5774
ispartof 22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007), 2007, p.400-408
issn 1550-5774
2377-7966
language eng
recordid cdi_ieee_primary_4358409
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Aggregates
Analytical models
Assembly systems
DNA
Error analysis
Error correction
Manufacturing
Redundancy
Self-assembly
Tiles
title Error Tolerance of DNA Self-Healing Assemblies by Puncturing
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T06%3A16%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Error%20Tolerance%20of%20DNA%20Self-Healing%20Assemblies%20by%20Puncturing&rft.btitle=22nd%20IEEE%20International%20Symposium%20on%20Defect%20and%20Fault-Tolerance%20in%20VLSI%20Systems%20(DFT%202007)&rft.au=Hashempour,%20M.&rft.date=2007-09&rft.spage=400&rft.epage=408&rft.pages=400-408&rft.issn=1550-5774&rft.eissn=2377-7966&rft.isbn=9780769528854&rft.isbn_list=0769528856&rft_id=info:doi/10.1109/DFT.2007.8&rft_dat=%3Cieee_6IE%3E4358409%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4358409&rfr_iscdi=true