$Multichip Integration on a PLC Platform for 16 \,\times\,16 Optical Switch Module Using Passive Alignment Technique$

Multichip Integration on a PLC Platform for 16 \,\times\,16 Optical Switch Module Using Passive Alignment Technique

We have integrated eight sets of four-channel semiconductor optical amplifier (SOA) array chips on a silica-based planar lightwave circuit (PLC) platform for 16 times 16 optical switch module by flip-chip bonding technique. To accurately bond eight sets of the arrayed SOA chips on a PLC platform, tw...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2007-08, Vol.30 (3), p.457-461
Hauptverfasser:	Rho, Byung Sup, Lim, Jung Woon
Format:	Artikel
Sprache:	eng
Schlagworte:	Assembly Bonding Flip-chip bonding Optical crosstalk Optical devices Optical signal processing optical switch Optical switches planar lightwave circuit (PLC) Programmable control semiconductor optical amplifier (SOA) Semiconductor optical amplifiers Stimulated emission Telecommunication switching
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