A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting...
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| creator | Ahmad, I. Jiun, Hoh Huey Leng, Eu Poh Majlis, B.Y. Jalar, A. Wagiran, R. |
| description | This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results. |
| doi_str_mv | 10.1109/SMELEC.2006.380690 |
| format | Conference Proceeding |
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Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.</description><identifier>ISBN: 9780780397309</identifier><identifier>ISBN: 0780397304</identifier><identifier>EISBN: 0780397312</identifier><identifier>EISBN: 9780780397316</identifier><identifier>DOI: 10.1109/SMELEC.2006.380690</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aluminum alloys ; Electronics packaging ; Environmentally friendly manufacturing techniques ; Intermetallic ; Lead ; Morphology ; Temperature ; Testing ; Tin ; Vehicles</subject><ispartof>2006 IEEE International Conference on Semiconductor Electronics, 2006, p.545-548</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4266673$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4266673$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ahmad, I.</creatorcontrib><creatorcontrib>Jiun, Hoh Huey</creatorcontrib><creatorcontrib>Leng, Eu Poh</creatorcontrib><creatorcontrib>Majlis, B.Y.</creatorcontrib><creatorcontrib>Jalar, A.</creatorcontrib><creatorcontrib>Wagiran, R.</creatorcontrib><title>A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System</title><title>2006 IEEE International Conference on Semiconductor Electronics</title><addtitle>SMELEC</addtitle><description>This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.</description><subject>Aluminum alloys</subject><subject>Electronics packaging</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Intermetallic</subject><subject>Lead</subject><subject>Morphology</subject><subject>Temperature</subject><subject>Testing</subject><subject>Tin</subject><subject>Vehicles</subject><isbn>9780780397309</isbn><isbn>0780397304</isbn><isbn>0780397312</isbn><isbn>9780780397316</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjM1Kw0AUhUdEUGteQDfzAql3fjKTWZbQaiHFRXQnlElzr0TyUyaTRd_egD2bw8d3OIw9C1gLAe61OmzLbbGWAGatcjAObtgj2ByUs0rIW5a4Ba4M7p4l0_QLS3SmFegH9r3hVZybCx8Hvh8ihvSA0Xdde-LF2J_HeWj4bgy9j-2y8AtVMcynOAfkI_ES_eIDIq-GzU8x82rsGgy8ukwR-yd2R76bMLn2in3ttp_Fe1p-vO2LTZm2wmYxJYvkEbTNsfFO1pQJTaTJS08ut1KjJSuRoMnqGoytwUovkBwtxoNRK_by_9si4vEc2t6Hy1FLY4xV6g_AHVT5</recordid><startdate>200611</startdate><enddate>200611</enddate><creator>Ahmad, I.</creator><creator>Jiun, Hoh Huey</creator><creator>Leng, Eu Poh</creator><creator>Majlis, B.Y.</creator><creator>Jalar, A.</creator><creator>Wagiran, R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200611</creationdate><title>A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System</title><author>Ahmad, I. ; Jiun, Hoh Huey ; Leng, Eu Poh ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f7efae0478eda92bf514ff4fa2af98724e7f72ef0d5bb067b072a1ef9f4e7a063</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Aluminum alloys</topic><topic>Electronics packaging</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Intermetallic</topic><topic>Lead</topic><topic>Morphology</topic><topic>Temperature</topic><topic>Testing</topic><topic>Tin</topic><topic>Vehicles</topic><toplevel>online_resources</toplevel><creatorcontrib>Ahmad, I.</creatorcontrib><creatorcontrib>Jiun, Hoh Huey</creatorcontrib><creatorcontrib>Leng, Eu Poh</creatorcontrib><creatorcontrib>Majlis, B.Y.</creatorcontrib><creatorcontrib>Jalar, A.</creatorcontrib><creatorcontrib>Wagiran, R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ahmad, I.</au><au>Jiun, Hoh Huey</au><au>Leng, Eu Poh</au><au>Majlis, B.Y.</au><au>Jalar, A.</au><au>Wagiran, R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System</atitle><btitle>2006 IEEE International Conference on Semiconductor Electronics</btitle><stitle>SMELEC</stitle><date>2006-11</date><risdate>2006</risdate><spage>545</spage><epage>548</epage><pages>545-548</pages><isbn>9780780397309</isbn><isbn>0780397304</isbn><eisbn>0780397312</eisbn><eisbn>9780780397316</eisbn><abstract>This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.</abstract><pub>IEEE</pub><doi>10.1109/SMELEC.2006.380690</doi><tpages>4</tpages></addata></record> |
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| subjects | Aluminum alloys Electronics packaging Environmentally friendly manufacturing techniques Intermetallic Lead Morphology Temperature Testing Tin Vehicles |
| title | A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System |
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