De-Embedding Considerations for High Q RFIC Inductors
In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-gro...
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creator | Goverdhanam, K. Tretiakov, Y. Rezvani, G.A. Kapur, S. Long, D.E. |
description | In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-ground-signal-ground (GSGSG) probe tip padset and de-embedding structures ("open" and "through") will be discussed. It will be shown, through EM simulations that accurate characterization of properly designed de-embedding structures results in very reliable and accurate de-embedding using the previously developed "open-thru" de-embedding method. |
doi_str_mv | 10.1109/RFIC.2007.380921 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4266469</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4266469</ieee_id><sourcerecordid>4266469</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-e771dcaf61f5cb88928d31803ecdd2f09e7047ad882bdfadd8167f66c06d06883</originalsourceid><addsrcrecordid>eNpVjUtLw0AURscXGGv3gpv5A1Pvncm8lhJbGyiIousyyZ2pIzaRJC7891Z04-o7cOB8jF0hLBDB3zyt6mohAexCOfASj9jcW4elLEvQCuUxK6SyWoD3-uSfA33KCtTSC6nRnrOLcXyDQwiNL5i-i2K5byJR7na86rsxUxzClA_EUz_wdd698kf-c8_rjj7bqR_GS3aWwvsY5387Yy-r5XO1FpuH-7q63YiMVk8iWovUhmQw6bZxzktHCh2o2BLJBD5aKG0g52RDKRA5NDYZ04IhMM6pGbv-7eYY4_ZjyPswfG1LaUxpvPoGUXRJBw</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>De-Embedding Considerations for High Q RFIC Inductors</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Goverdhanam, K. ; Tretiakov, Y. ; Rezvani, G.A. ; Kapur, S. ; Long, D.E.</creator><creatorcontrib>Goverdhanam, K. ; Tretiakov, Y. ; Rezvani, G.A. ; Kapur, S. ; Long, D.E.</creatorcontrib><description>In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-ground-signal-ground (GSGSG) probe tip padset and de-embedding structures ("open" and "through") will be discussed. It will be shown, through EM simulations that accurate characterization of properly designed de-embedding structures results in very reliable and accurate de-embedding using the previously developed "open-thru" de-embedding method.</description><identifier>ISSN: 1529-2517</identifier><identifier>ISBN: 9781424405305</identifier><identifier>ISBN: 1424405300</identifier><identifier>EISSN: 2375-0995</identifier><identifier>EISBN: 9781424405312</identifier><identifier>EISBN: 1424405319</identifier><identifier>DOI: 10.1109/RFIC.2007.380921</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bridge circuits ; Circuit simulation ; De-embedding ; Impedance ; Inductance ; inductor characterization ; Inductors ; open-thru method ; padset ; Probes ; Q factor ; Radio frequency ; Radiofrequency integrated circuits ; Scattering parameters</subject><ispartof>2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2007, p.449-452</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4266469$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4266469$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Goverdhanam, K.</creatorcontrib><creatorcontrib>Tretiakov, Y.</creatorcontrib><creatorcontrib>Rezvani, G.A.</creatorcontrib><creatorcontrib>Kapur, S.</creatorcontrib><creatorcontrib>Long, D.E.</creatorcontrib><title>De-Embedding Considerations for High Q RFIC Inductors</title><title>2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium</title><addtitle>RFIC</addtitle><description>In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-ground-signal-ground (GSGSG) probe tip padset and de-embedding structures ("open" and "through") will be discussed. It will be shown, through EM simulations that accurate characterization of properly designed de-embedding structures results in very reliable and accurate de-embedding using the previously developed "open-thru" de-embedding method.</description><subject>Bridge circuits</subject><subject>Circuit simulation</subject><subject>De-embedding</subject><subject>Impedance</subject><subject>Inductance</subject><subject>inductor characterization</subject><subject>Inductors</subject><subject>open-thru method</subject><subject>padset</subject><subject>Probes</subject><subject>Q factor</subject><subject>Radio frequency</subject><subject>Radiofrequency integrated circuits</subject><subject>Scattering parameters</subject><issn>1529-2517</issn><issn>2375-0995</issn><isbn>9781424405305</isbn><isbn>1424405300</isbn><isbn>9781424405312</isbn><isbn>1424405319</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVjUtLw0AURscXGGv3gpv5A1Pvncm8lhJbGyiIousyyZ2pIzaRJC7891Z04-o7cOB8jF0hLBDB3zyt6mohAexCOfASj9jcW4elLEvQCuUxK6SyWoD3-uSfA33KCtTSC6nRnrOLcXyDQwiNL5i-i2K5byJR7na86rsxUxzClA_EUz_wdd698kf-c8_rjj7bqR_GS3aWwvsY5387Yy-r5XO1FpuH-7q63YiMVk8iWovUhmQw6bZxzktHCh2o2BLJBD5aKG0g52RDKRA5NDYZ04IhMM6pGbv-7eYY4_ZjyPswfG1LaUxpvPoGUXRJBw</recordid><startdate>200706</startdate><enddate>200706</enddate><creator>Goverdhanam, K.</creator><creator>Tretiakov, Y.</creator><creator>Rezvani, G.A.</creator><creator>Kapur, S.</creator><creator>Long, D.E.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200706</creationdate><title>De-Embedding Considerations for High Q RFIC Inductors</title><author>Goverdhanam, K. ; Tretiakov, Y. ; Rezvani, G.A. ; Kapur, S. ; Long, D.E.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-e771dcaf61f5cb88928d31803ecdd2f09e7047ad882bdfadd8167f66c06d06883</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Bridge circuits</topic><topic>Circuit simulation</topic><topic>De-embedding</topic><topic>Impedance</topic><topic>Inductance</topic><topic>inductor characterization</topic><topic>Inductors</topic><topic>open-thru method</topic><topic>padset</topic><topic>Probes</topic><topic>Q factor</topic><topic>Radio frequency</topic><topic>Radiofrequency integrated circuits</topic><topic>Scattering parameters</topic><toplevel>online_resources</toplevel><creatorcontrib>Goverdhanam, K.</creatorcontrib><creatorcontrib>Tretiakov, Y.</creatorcontrib><creatorcontrib>Rezvani, G.A.</creatorcontrib><creatorcontrib>Kapur, S.</creatorcontrib><creatorcontrib>Long, D.E.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Goverdhanam, K.</au><au>Tretiakov, Y.</au><au>Rezvani, G.A.</au><au>Kapur, S.</au><au>Long, D.E.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>De-Embedding Considerations for High Q RFIC Inductors</atitle><btitle>2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium</btitle><stitle>RFIC</stitle><date>2007-06</date><risdate>2007</risdate><spage>449</spage><epage>452</epage><pages>449-452</pages><issn>1529-2517</issn><eissn>2375-0995</eissn><isbn>9781424405305</isbn><isbn>1424405300</isbn><eisbn>9781424405312</eisbn><eisbn>1424405319</eisbn><abstract>In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-ground-signal-ground (GSGSG) probe tip padset and de-embedding structures ("open" and "through") will be discussed. It will be shown, through EM simulations that accurate characterization of properly designed de-embedding structures results in very reliable and accurate de-embedding using the previously developed "open-thru" de-embedding method.</abstract><pub>IEEE</pub><doi>10.1109/RFIC.2007.380921</doi><tpages>4</tpages></addata></record> |
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ispartof | 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2007, p.449-452 |
issn | 1529-2517 2375-0995 |
language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Bridge circuits Circuit simulation De-embedding Impedance Inductance inductor characterization Inductors open-thru method padset Probes Q factor Radio frequency Radiofrequency integrated circuits Scattering parameters |
title | De-Embedding Considerations for High Q RFIC Inductors |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T06%3A15%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=De-Embedding%20Considerations%20for%20High%20Q%20RFIC%20Inductors&rft.btitle=2007%20IEEE%20Radio%20Frequency%20Integrated%20Circuits%20(RFIC)%20Symposium&rft.au=Goverdhanam,%20K.&rft.date=2007-06&rft.spage=449&rft.epage=452&rft.pages=449-452&rft.issn=1529-2517&rft.eissn=2375-0995&rft.isbn=9781424405305&rft.isbn_list=1424405300&rft_id=info:doi/10.1109/RFIC.2007.380921&rft_dat=%3Cieee_6IE%3E4266469%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781424405312&rft.eisbn_list=1424405319&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4266469&rfr_iscdi=true |