High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were reco...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1513 |
|---|---|
| container_issue | |
| container_start_page | 1504 |
| container_title | |
| container_volume | |
| creator | Fubin Song Lee, S.W.R. Newman, K. Sykes, B. Clark, S. |
| description | This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were recorded, together with force and fracture energy data. In addition, detailed microscopic analysis (SEM and EDX) was executed on both complementary surfaces (ball and pad) of brittle fracture failures from both shear and pull test samples. The results of these studies showed close similarity to those from brittle fractures generated during BLDT of the same packages. Furthermore, there was strong correlation between various bondtesting parameters at which brittle fractures occurred and the number of drops to failure seen in BLDT. In summary, it is suggested that brittle fractures obtained in high-speed bondtesting are a strong indicator of BLDT behavior. |
| doi_str_mv | 10.1109/ECTC.2007.373994 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4250080</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4250080</ieee_id><sourcerecordid>4250080</sourcerecordid><originalsourceid>FETCH-LOGICAL-i241t-cdf15fc05a8db59153b6aa21b484be9593a366719cdeeb1051e1616abdde4ce53</originalsourceid><addsrcrecordid>eNo1jUtLAzEYReMLrLV7wU3-wIx5Z-LOjtUKUxRa1yUz-aaNxEnJtAV3_nSl1dXlcg_nInRDSU4pMXeTclHmjBCdc82NESfoigomBDGF5KdowLjWmdRMnaGR0cX_JtQ5GhCpTCYl4Zdo1PcfhBCqlSBMD9D31K_W2XwD4PA8BgcJj20IeL4Gm7DtHH7b_dYF9Nse7_scj6NNDlewh4Bn0Kxt5xsb8GOKmyN1j8uYEgS79bHDscVP1oddAjyLDg7GKlrnuxU-vF6ji9aGHkZ_OUTvT5NFOc2q1-eX8qHKPBN0mzWupbJtiLSFq6WhktfKWkZrUYgajDTccqU0NY0DqCmRFKiiytbOgWhA8iG6PXo9ACw3yX_a9LUUTBJSEP4DsIVjrA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Fubin Song ; Lee, S.W.R. ; Newman, K. ; Sykes, B. ; Clark, S.</creator><creatorcontrib>Fubin Song ; Lee, S.W.R. ; Newman, K. ; Sykes, B. ; Clark, S.</creatorcontrib><description>This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were recorded, together with force and fracture energy data. In addition, detailed microscopic analysis (SEM and EDX) was executed on both complementary surfaces (ball and pad) of brittle fracture failures from both shear and pull test samples. The results of these studies showed close similarity to those from brittle fractures generated during BLDT of the same packages. Furthermore, there was strong correlation between various bondtesting parameters at which brittle fractures occurred and the number of drops to failure seen in BLDT. In summary, it is suggested that brittle fractures obtained in high-speed bondtesting are a strong indicator of BLDT behavior.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9781424409846</identifier><identifier>ISBN: 1424409845</identifier><identifier>EISSN: 2377-5726</identifier><identifier>EISBN: 1424409853</identifier><identifier>EISBN: 9781424409853</identifier><identifier>DOI: 10.1109/ECTC.2007.373994</identifier><language>eng</language><publisher>IEEE</publisher><subject>Absorption ; Bonding ; Circuit testing ; Environmentally friendly manufacturing techniques ; Failure analysis ; Packaging ; Scanning electron microscopy ; Soldering ; Surface cracks ; Surface finishing</subject><ispartof>2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1504-1513</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4250080$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4250080$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Fubin Song</creatorcontrib><creatorcontrib>Lee, S.W.R.</creatorcontrib><creatorcontrib>Newman, K.</creatorcontrib><creatorcontrib>Sykes, B.</creatorcontrib><creatorcontrib>Clark, S.</creatorcontrib><title>High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed</title><title>2007 Proceedings 57th Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were recorded, together with force and fracture energy data. In addition, detailed microscopic analysis (SEM and EDX) was executed on both complementary surfaces (ball and pad) of brittle fracture failures from both shear and pull test samples. The results of these studies showed close similarity to those from brittle fractures generated during BLDT of the same packages. Furthermore, there was strong correlation between various bondtesting parameters at which brittle fractures occurred and the number of drops to failure seen in BLDT. In summary, it is suggested that brittle fractures obtained in high-speed bondtesting are a strong indicator of BLDT behavior.</description><subject>Absorption</subject><subject>Bonding</subject><subject>Circuit testing</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Failure analysis</subject><subject>Packaging</subject><subject>Scanning electron microscopy</subject><subject>Soldering</subject><subject>Surface cracks</subject><subject>Surface finishing</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9781424409846</isbn><isbn>1424409845</isbn><isbn>1424409853</isbn><isbn>9781424409853</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1jUtLAzEYReMLrLV7wU3-wIx5Z-LOjtUKUxRa1yUz-aaNxEnJtAV3_nSl1dXlcg_nInRDSU4pMXeTclHmjBCdc82NESfoigomBDGF5KdowLjWmdRMnaGR0cX_JtQ5GhCpTCYl4Zdo1PcfhBCqlSBMD9D31K_W2XwD4PA8BgcJj20IeL4Gm7DtHH7b_dYF9Nse7_scj6NNDlewh4Bn0Kxt5xsb8GOKmyN1j8uYEgS79bHDscVP1oddAjyLDg7GKlrnuxU-vF6ji9aGHkZ_OUTvT5NFOc2q1-eX8qHKPBN0mzWupbJtiLSFq6WhktfKWkZrUYgajDTccqU0NY0DqCmRFKiiytbOgWhA8iG6PXo9ACw3yX_a9LUUTBJSEP4DsIVjrA</recordid><startdate>20070101</startdate><enddate>20070101</enddate><creator>Fubin Song</creator><creator>Lee, S.W.R.</creator><creator>Newman, K.</creator><creator>Sykes, B.</creator><creator>Clark, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>20070101</creationdate><title>High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed</title><author>Fubin Song ; Lee, S.W.R. ; Newman, K. ; Sykes, B. ; Clark, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i241t-cdf15fc05a8db59153b6aa21b484be9593a366719cdeeb1051e1616abdde4ce53</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Absorption</topic><topic>Bonding</topic><topic>Circuit testing</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Failure analysis</topic><topic>Packaging</topic><topic>Scanning electron microscopy</topic><topic>Soldering</topic><topic>Surface cracks</topic><topic>Surface finishing</topic><toplevel>online_resources</toplevel><creatorcontrib>Fubin Song</creatorcontrib><creatorcontrib>Lee, S.W.R.</creatorcontrib><creatorcontrib>Newman, K.</creatorcontrib><creatorcontrib>Sykes, B.</creatorcontrib><creatorcontrib>Clark, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fubin Song</au><au>Lee, S.W.R.</au><au>Newman, K.</au><au>Sykes, B.</au><au>Clark, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed</atitle><btitle>2007 Proceedings 57th Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>2007-01-01</date><risdate>2007</risdate><spage>1504</spage><epage>1513</epage><pages>1504-1513</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9781424409846</isbn><isbn>1424409845</isbn><eisbn>1424409853</eisbn><eisbn>9781424409853</eisbn><abstract>This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were recorded, together with force and fracture energy data. In addition, detailed microscopic analysis (SEM and EDX) was executed on both complementary surfaces (ball and pad) of brittle fracture failures from both shear and pull test samples. The results of these studies showed close similarity to those from brittle fractures generated during BLDT of the same packages. Furthermore, there was strong correlation between various bondtesting parameters at which brittle fractures occurred and the number of drops to failure seen in BLDT. In summary, it is suggested that brittle fractures obtained in high-speed bondtesting are a strong indicator of BLDT behavior.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2007.373994</doi><tpages>10</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0569-5503 |
| ispartof | 2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1504-1513 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_4250080 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Absorption Bonding Circuit testing Environmentally friendly manufacturing techniques Failure analysis Packaging Scanning electron microscopy Soldering Surface cracks Surface finishing |
| title | High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T14%3A35%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=High-Speed%20Solder%20Ball%20Shear%20and%20Pull%20Tests%20vs.%20Board%20Level%20Mechanical%20Drop%20Tests:%20Correlation%20of%20Failure%20Mode%20and%20Loading%20Speed&rft.btitle=2007%20Proceedings%2057th%20Electronic%20Components%20and%20Technology%20Conference&rft.au=Fubin%20Song&rft.date=2007-01-01&rft.spage=1504&rft.epage=1513&rft.pages=1504-1513&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9781424409846&rft.isbn_list=1424409845&rft_id=info:doi/10.1109/ECTC.2007.373994&rft_dat=%3Cieee_6IE%3E4250080%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424409853&rft.eisbn_list=9781424409853&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4250080&rfr_iscdi=true |