Electromigration Study in Flip Chip Solder Joints

We have studied the effect of thickness of Cu under bump metallization (UBM) from 5 μm, 10 μm to 50 μm on electromigration induced failure mechanism in flip chip solder joints. In the case of 5 μm Cu UBM, due to the direct current crowding effect at the UBM/solder interface, the failure mode induced...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jae-Woong Nah, Kai Chen, Suh, J.O., Tu, K.N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Current density Electromigration Electrons Flip chip Flip chip solder joints Metallization Proximity effect Temperature Tin
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