Novel Low-Temperature CoC Interconnection Technology for Multichip LSI (MCL)

We developed a novel low-temperature chip on chip (CoC) interconnection technology featuring several thousand micro-solder bumps and a low-temperature process below 180°C. The data transfer rate between chips becomes comparable to a system on chip (SoC) by using this technology. The test chips we us...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wakiyama, S., Ozaki, H., Nabe, Y., Kume, T., Ezaki, T., Ogawa, T.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding processes Electric resistance Gold Indium Integrated circuit interconnections Intermetallic Large scale integration Temperature Testing Vehicles
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