Fine Pitch Compliant Bump Interconnection for Flip chip on Flexible Display Packaging by Anisotropic Conductive Film

Today, there is an increasing demand for flexible liquid crystal display (LCD) in many applications such as mobile phone, smart cards, electronic newspaper and integrated display. The requirement for better display resolution and image quality necessitate the use of advanced packaging technology bec...

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Bibliographische Detailangaben

Hauptverfasser:	Yao-Sheng Lin, Tsung-Fu Yang, Wen-Chi Chen, Tai-Hung Chen, Chun-Cheng Cheng, Yung-Hui Yeh
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Anisotropic conductive films Bonding Contact resistance Flip chip Liquid crystal displays Packaging Smart cards Substrates Temperature Testing
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