Assembly and Application Specific Methodology to Determine Accelerated Temperature Cycling Requirements for Pb-free Solder Joint Reliability

An assembly-and application-specific methodology is proposed to address the issue of accelerated temperature cycling test requirements for solder joint reliability. This is accomplished by first determining the amount of solder damage that is expected to accumulate in the field over a specified peri...

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Bibliographische Detailangaben
1. Verfasser:	Ron Zhang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	accelerated temperature cycling Acceleration Assembly systems equivalent damage Life estimation Materials testing Pb-free solder joints power cycling Power dissipation Power generation Qualifications reliability methodology Soldering Sun Temperature distribution test standards
Online-Zugang:	Volltext bestellen
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