Reliability Studies on Non Planar DRAM Cell Transistor

We have experimentally analyzed the leakage mechanism and device degradations caused by the F-N and hot carrier stresses for the recently developed DRAM cell transistors having deeply recessed channels. We have found the important difference of the leakage mechanism between S-Fin and RCAT, which hav...

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Hauptverfasser: Myoung Jin Lee, Seonghoon Jin, Chang-Ki Baek, Sung-Min Hong, Soo-Young Park, Hong-Hyun Park, Sang-Don Lee, Sung-Woong Chung, Jae-Goan Jeong, Sung-Joo Hong, Sung-Wook Park, In-Young Chung, Young June Park, Hong Shick Min
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creator Myoung Jin Lee
Seonghoon Jin
Chang-Ki Baek
Sung-Min Hong
Soo-Young Park
Hong-Hyun Park
Sang-Don Lee
Sung-Woong Chung
Jae-Goan Jeong
Sung-Joo Hong
Sung-Wook Park
In-Young Chung
Young June Park
Hong Shick Min
description We have experimentally analyzed the leakage mechanism and device degradations caused by the F-N and hot carrier stresses for the recently developed DRAM cell transistors having deeply recessed channels. We have found the important difference of the leakage mechanism between S-Fin and RCAT, which have each structural benefit in the characteristics of leakage current, so we can suggest the guide lines for device structures simultaneously having each merit in both structures.
doi_str_mv 10.1109/RELPHY.2007.370000
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ispartof 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.660-661
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1938-1891
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subjects Current measurement
Degradation
Doping
FinFETs
Hot carriers
Leakage current
Nanoscale devices
Random access memory
Stress
Voltage
title Reliability Studies on Non Planar DRAM Cell Transistor
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