Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2007-05, Vol.30 (2), p.180-190
Hauptverfasser:	Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Srinivasan, K., Govind, V., Joungho Kim, Swaminathan, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alternating impedance electromagnetic bandgap (AI-EBG) structure Analytical models Banded structure Boards Design engineering Electromagnetic analysis electromagnetic interference (EMI) Electromagnetic measurements far-field (FF) Guidelines Impedance mixed-signal system near-field (NF) noise isolation Noise measurement Packages Packaging Periodic structures Power measurement radiation signal integrity Simulation Solvers Testing Vehicles
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Beschreibung
Zusammenfassung:	This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems
ISSN:	1521-3323 1557-9980
DOI:	10.1109/TADVP.2007.896921