Flexible Tactile Sensor Fabricated using Polymer Membrane
We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible prin...
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| creator | Woo-Sung Cho Kunnyun Kim Kang Ryeol Lee Yong-Kook Kim Dae-Sung Lee Won Hyo Kim Nam-Kyu Cho Kwang-Bum Park Hyo-Derk Park Jung-Ho Park Byeong-Kwon Ju |
| description | We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor. |
| doi_str_mv | 10.1109/ICSENS.2007.355572 |
| format | Conference Proceeding |
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The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.</description><identifier>ISSN: 1930-0395</identifier><identifier>ISBN: 1424403758</identifier><identifier>ISBN: 9781424403752</identifier><identifier>EISSN: 2168-9229</identifier><identifier>EISBN: 9781424403769</identifier><identifier>EISBN: 1424403766</identifier><identifier>DOI: 10.1109/ICSENS.2007.355572</identifier><language>eng</language><publisher>IEEE</publisher><subject>Biomembranes ; Fabrication ; Flexible printed circuits ; Force sensors ; Micromachining ; Packaging ; Polymers ; Sensor phenomena and characterization ; Silicon ; Tactile sensors</subject><ispartof>2006 5th IEEE Conference on Sensors, 2006, p.730-733</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4178724$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4178724$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Woo-Sung Cho</creatorcontrib><creatorcontrib>Kunnyun Kim</creatorcontrib><creatorcontrib>Kang Ryeol Lee</creatorcontrib><creatorcontrib>Yong-Kook Kim</creatorcontrib><creatorcontrib>Dae-Sung Lee</creatorcontrib><creatorcontrib>Won Hyo Kim</creatorcontrib><creatorcontrib>Nam-Kyu Cho</creatorcontrib><creatorcontrib>Kwang-Bum Park</creatorcontrib><creatorcontrib>Hyo-Derk Park</creatorcontrib><creatorcontrib>Jung-Ho Park</creatorcontrib><creatorcontrib>Byeong-Kwon Ju</creatorcontrib><title>Flexible Tactile Sensor Fabricated using Polymer Membrane</title><title>2006 5th IEEE Conference on Sensors</title><addtitle>ICSENS</addtitle><description>We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.</description><subject>Biomembranes</subject><subject>Fabrication</subject><subject>Flexible printed circuits</subject><subject>Force sensors</subject><subject>Micromachining</subject><subject>Packaging</subject><subject>Polymers</subject><subject>Sensor phenomena and characterization</subject><subject>Silicon</subject><subject>Tactile sensors</subject><issn>1930-0395</issn><issn>2168-9229</issn><isbn>1424403758</isbn><isbn>9781424403752</isbn><isbn>9781424403769</isbn><isbn>1424403766</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1j81OhDAURutfIjPOC-iGFwBvb1vaLg0ZdJLxJ2FcT0q5mBpgDGDivL0YdXUWJ_lyPsauOaScg73d5OX6qUwRQKdCKaXxhK2sNlyilCB0Zk9ZhDwziUW0Z2zxL5Q5ZxG3AhIQVl2yxTi-AyAoNBGzRUtfoWop3jk_hZkl9eNhiAtXDcG7ier4cwz9W_xyaI8dDfEjddXgerpiF41rR1r9cclei_Uuf0i2z_eb_G6bBK7VlGSN9MYJrzLUZG1D4DNRG_TyJ05gbV1To5uTFXCSJHUNFVlyjZyfZpVYspvf3UBE-48hdG447iXXRqMU3y54Sws</recordid><startdate>200610</startdate><enddate>200610</enddate><creator>Woo-Sung Cho</creator><creator>Kunnyun Kim</creator><creator>Kang Ryeol Lee</creator><creator>Yong-Kook Kim</creator><creator>Dae-Sung Lee</creator><creator>Won Hyo Kim</creator><creator>Nam-Kyu Cho</creator><creator>Kwang-Bum Park</creator><creator>Hyo-Derk Park</creator><creator>Jung-Ho Park</creator><creator>Byeong-Kwon Ju</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200610</creationdate><title>Flexible Tactile Sensor Fabricated using Polymer Membrane</title><author>Woo-Sung Cho ; Kunnyun Kim ; Kang Ryeol Lee ; Yong-Kook Kim ; Dae-Sung Lee ; Won Hyo Kim ; Nam-Kyu Cho ; Kwang-Bum Park ; Hyo-Derk Park ; Jung-Ho Park ; Byeong-Kwon Ju</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6f4c8a3c5627e99fe0c63d82c4440332d9afd2a229501e4e47d0be9eaf40076b3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Biomembranes</topic><topic>Fabrication</topic><topic>Flexible printed circuits</topic><topic>Force sensors</topic><topic>Micromachining</topic><topic>Packaging</topic><topic>Polymers</topic><topic>Sensor phenomena and characterization</topic><topic>Silicon</topic><topic>Tactile sensors</topic><toplevel>online_resources</toplevel><creatorcontrib>Woo-Sung Cho</creatorcontrib><creatorcontrib>Kunnyun Kim</creatorcontrib><creatorcontrib>Kang Ryeol Lee</creatorcontrib><creatorcontrib>Yong-Kook Kim</creatorcontrib><creatorcontrib>Dae-Sung Lee</creatorcontrib><creatorcontrib>Won Hyo Kim</creatorcontrib><creatorcontrib>Nam-Kyu Cho</creatorcontrib><creatorcontrib>Kwang-Bum Park</creatorcontrib><creatorcontrib>Hyo-Derk Park</creatorcontrib><creatorcontrib>Jung-Ho Park</creatorcontrib><creatorcontrib>Byeong-Kwon Ju</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Woo-Sung Cho</au><au>Kunnyun Kim</au><au>Kang Ryeol Lee</au><au>Yong-Kook Kim</au><au>Dae-Sung Lee</au><au>Won Hyo Kim</au><au>Nam-Kyu Cho</au><au>Kwang-Bum Park</au><au>Hyo-Derk Park</au><au>Jung-Ho Park</au><au>Byeong-Kwon Ju</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Flexible Tactile Sensor Fabricated using Polymer Membrane</atitle><btitle>2006 5th IEEE Conference on Sensors</btitle><stitle>ICSENS</stitle><date>2006-10</date><risdate>2006</risdate><spage>730</spage><epage>733</epage><pages>730-733</pages><issn>1930-0395</issn><eissn>2168-9229</eissn><isbn>1424403758</isbn><isbn>9781424403752</isbn><eisbn>9781424403769</eisbn><eisbn>1424403766</eisbn><abstract>We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.</abstract><pub>IEEE</pub><doi>10.1109/ICSENS.2007.355572</doi><tpages>4</tpages></addata></record> |
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| identifier | ISSN: 1930-0395 |
| ispartof | 2006 5th IEEE Conference on Sensors, 2006, p.730-733 |
| issn | 1930-0395 2168-9229 |
| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Biomembranes Fabrication Flexible printed circuits Force sensors Micromachining Packaging Polymers Sensor phenomena and characterization Silicon Tactile sensors |
| title | Flexible Tactile Sensor Fabricated using Polymer Membrane |
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