An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics
This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 8 |
|---|---|
| container_issue | |
| container_start_page | 1 |
| container_title | |
| container_volume | |
| creator | Guangfan Zhang Chiman Kwan Xu, R. Vichare, N. Pecht, M. |
| description | This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads. |
| doi_str_mv | 10.1109/AERO.2007.352884 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4161661</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4161661</ieee_id><sourcerecordid>4161661</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-eecdf5bc5282bfc7256cda71c5f6bc19d7a77896bbe42ed86ac8d5bc9ad8ae413</originalsourceid><addsrcrecordid>eNpFjztPwzAYRc1Loi3sSCz-Awm24-cYlRQqtSpCHdgqx_5SjFIHOWbg3xMJJKY73HOPdBG6o6SklJiHunndlYwQVVaCac3P0JxyxjkRTPBzNGPGyIJVQl_8F1xeotk0FkXFqrdrNB_HD0IYYZrM0LaOuInvNjrw-CUNxziMOTi8HTz0uBsSXscM6RRyhpjxyob-K8GIQ8SP4Riy7XHTg8tpiMGNN-iqs_0It3-5QPtVs18-F5vd03pZb4pgSC4AnO9E66YHrO2cYkI6bxV1opOto8Yrq5Q2sm2BM_BaWqf9xBvrtQVOqwW6_9UGADh8pnCy6fvAqaRS0uoHDilSwQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Guangfan Zhang ; Chiman Kwan ; Xu, R. ; Vichare, N. ; Pecht, M.</creator><creatorcontrib>Guangfan Zhang ; Chiman Kwan ; Xu, R. ; Vichare, N. ; Pecht, M.</creatorcontrib><description>This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads.</description><identifier>ISSN: 1095-323X</identifier><identifier>ISBN: 1424405246</identifier><identifier>ISBN: 9781424405244</identifier><identifier>EISSN: 2996-2358</identifier><identifier>EISBN: 1424405254</identifier><identifier>EISBN: 9781424405251</identifier><identifier>DOI: 10.1109/AERO.2007.352884</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aerospace electronics ; Automation ; Condition monitoring ; Electrical resistance measurement ; Load modeling ; Prediction algorithms ; Predictive models ; Prognostics and health management ; Soldering ; Temperature measurement</subject><ispartof>2007 IEEE Aerospace Conference, 2007, p.1-8</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4161661$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,777,781,786,787,2052,27906,54901</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4161661$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Guangfan Zhang</creatorcontrib><creatorcontrib>Chiman Kwan</creatorcontrib><creatorcontrib>Xu, R.</creatorcontrib><creatorcontrib>Vichare, N.</creatorcontrib><creatorcontrib>Pecht, M.</creatorcontrib><title>An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics</title><title>2007 IEEE Aerospace Conference</title><addtitle>AERO</addtitle><description>This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads.</description><subject>Aerospace electronics</subject><subject>Automation</subject><subject>Condition monitoring</subject><subject>Electrical resistance measurement</subject><subject>Load modeling</subject><subject>Prediction algorithms</subject><subject>Predictive models</subject><subject>Prognostics and health management</subject><subject>Soldering</subject><subject>Temperature measurement</subject><issn>1095-323X</issn><issn>2996-2358</issn><isbn>1424405246</isbn><isbn>9781424405244</isbn><isbn>1424405254</isbn><isbn>9781424405251</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFjztPwzAYRc1Loi3sSCz-Awm24-cYlRQqtSpCHdgqx_5SjFIHOWbg3xMJJKY73HOPdBG6o6SklJiHunndlYwQVVaCac3P0JxyxjkRTPBzNGPGyIJVQl_8F1xeotk0FkXFqrdrNB_HD0IYYZrM0LaOuInvNjrw-CUNxziMOTi8HTz0uBsSXscM6RRyhpjxyob-K8GIQ8SP4Riy7XHTg8tpiMGNN-iqs_0It3-5QPtVs18-F5vd03pZb4pgSC4AnO9E66YHrO2cYkI6bxV1opOto8Yrq5Q2sm2BM_BaWqf9xBvrtQVOqwW6_9UGADh8pnCy6fvAqaRS0uoHDilSwQ</recordid><startdate>200703</startdate><enddate>200703</enddate><creator>Guangfan Zhang</creator><creator>Chiman Kwan</creator><creator>Xu, R.</creator><creator>Vichare, N.</creator><creator>Pecht, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200703</creationdate><title>An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics</title><author>Guangfan Zhang ; Chiman Kwan ; Xu, R. ; Vichare, N. ; Pecht, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-eecdf5bc5282bfc7256cda71c5f6bc19d7a77896bbe42ed86ac8d5bc9ad8ae413</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Aerospace electronics</topic><topic>Automation</topic><topic>Condition monitoring</topic><topic>Electrical resistance measurement</topic><topic>Load modeling</topic><topic>Prediction algorithms</topic><topic>Predictive models</topic><topic>Prognostics and health management</topic><topic>Soldering</topic><topic>Temperature measurement</topic><toplevel>online_resources</toplevel><creatorcontrib>Guangfan Zhang</creatorcontrib><creatorcontrib>Chiman Kwan</creatorcontrib><creatorcontrib>Xu, R.</creatorcontrib><creatorcontrib>Vichare, N.</creatorcontrib><creatorcontrib>Pecht, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Guangfan Zhang</au><au>Chiman Kwan</au><au>Xu, R.</au><au>Vichare, N.</au><au>Pecht, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics</atitle><btitle>2007 IEEE Aerospace Conference</btitle><stitle>AERO</stitle><date>2007-03</date><risdate>2007</risdate><spage>1</spage><epage>8</epage><pages>1-8</pages><issn>1095-323X</issn><eissn>2996-2358</eissn><isbn>1424405246</isbn><isbn>9781424405244</isbn><eisbn>1424405254</eisbn><eisbn>9781424405251</eisbn><abstract>This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads.</abstract><pub>IEEE</pub><doi>10.1109/AERO.2007.352884</doi><tpages>8</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1095-323X |
| ispartof | 2007 IEEE Aerospace Conference, 2007, p.1-8 |
| issn | 1095-323X 2996-2358 |
| language | eng |
| recordid | cdi_ieee_primary_4161661 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aerospace electronics Automation Condition monitoring Electrical resistance measurement Load modeling Prediction algorithms Predictive models Prognostics and health management Soldering Temperature measurement |
| title | An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T05%3A38%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=An%20Enhanced%20Prognostic%20Model%20for%20Intermittent%20Failures%20in%20Digital%20Electronics&rft.btitle=2007%20IEEE%20Aerospace%20Conference&rft.au=Guangfan%20Zhang&rft.date=2007-03&rft.spage=1&rft.epage=8&rft.pages=1-8&rft.issn=1095-323X&rft.eissn=2996-2358&rft.isbn=1424405246&rft.isbn_list=9781424405244&rft_id=info:doi/10.1109/AERO.2007.352884&rft_dat=%3Cieee_6IE%3E4161661%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424405254&rft.eisbn_list=9781424405251&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4161661&rfr_iscdi=true |