RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module

Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print confi...

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Bibliographische Detailangaben

Hauptverfasser:	Hafer, C., Mabra, J., Slocum, D., Thorne, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Assembly Bonding Packaging Plasma applications Power supplies Random access memory Springs Stacking Wire
Online-Zugang:	Volltext bestellen
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