Effect of minor doping elements on lead free solder joint quality

During lead free transition, board level drop test reliability has become an important issue since current Sn3~4Ag0.5Cu lead free solder showed poorer reliability than SnPb solder. In order to improve the reliability, solder composition change to Sn1Ag0.8Cu is one of the potential solutions by preve...

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Bibliographische Detailangaben
Hauptverfasser:	Don-Son Jiang, Yu-Po Wang, Hsiao, C.S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Doping Environmentally friendly manufacturing techniques Gold Lead Microstructure Soldering Surface finishing Temperature Testing Zinc
Online-Zugang:	Volltext bestellen
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