Flow Simulation: Advanced Dielectric Etch Equipment Design and Process Development

With shrinkage in device size, use of new materials in multiple layers, and larger wafer size, control of process uniformity across the wafer becomes crucial in semiconductor manufacturing. Flow simulation has been used to design advanced dielectric etch equipment to achieve better flow uniformity....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bera, K., Carducci, J., Hoffman, D., Ma, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Dielectric devices Dielectric materials Etching Plasma applications Plasma simulation Process control Process design Scanning electron microscopy Semiconductor materials Size control
Online-Zugang:	Volltext bestellen
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