Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates
This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone,...
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| creator | Ghiu, C.-D. Dalmia, S. Vickers, J. Carastro, L. Czakon, W. Sundaram, V. White, G. |
| description | This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC |
| doi_str_mv | 10.1109/EMICC.2006.282704 |
| format | Conference Proceeding |
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Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC</description><identifier>ISBN: 9782960055184</identifier><identifier>ISBN: 2960055187</identifier><identifier>DOI: 10.1109/EMICC.2006.282704</identifier><language>eng</language><publisher>IEEE</publisher><subject>Crystallization ; Diplexer ; direct current ; Inductors ; IPD ; Laminates ; Liquid crystal polymers ; Nonhomogeneous media ; organics ; Packaging ; Radio frequency ; Stability ; substrate ; Temperature distribution ; Testing ; thermal</subject><ispartof>2006 European Microwave Integrated Circuits Conference, 2006, p.545-547</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4057698$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4057698$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ghiu, C.-D.</creatorcontrib><creatorcontrib>Dalmia, S.</creatorcontrib><creatorcontrib>Vickers, J.</creatorcontrib><creatorcontrib>Carastro, L.</creatorcontrib><creatorcontrib>Czakon, W.</creatorcontrib><creatorcontrib>Sundaram, V.</creatorcontrib><creatorcontrib>White, G.</creatorcontrib><title>Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates</title><title>2006 European Microwave Integrated Circuits Conference</title><addtitle>EMICC</addtitle><description>This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC</description><subject>Crystallization</subject><subject>Diplexer</subject><subject>direct current</subject><subject>Inductors</subject><subject>IPD</subject><subject>Laminates</subject><subject>Liquid crystal polymers</subject><subject>Nonhomogeneous media</subject><subject>organics</subject><subject>Packaging</subject><subject>Radio frequency</subject><subject>Stability</subject><subject>substrate</subject><subject>Temperature distribution</subject><subject>Testing</subject><subject>thermal</subject><isbn>9782960055184</isbn><isbn>2960055187</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjN1KwzAYQAMiKLMPIN7kBVq_pPm9nHW6QacDdz_S5suIdp027WBvr6I351ydQ8gtg4IxsPeL9aqqCg6gCm64BnFBMqsNtwpASmbEFclSegcAZpUWXF6T9dyfXN-ip-Uj3bj2w-1jv6dT-uXL8YQdrePXFD2thnMaXdfFHunm2J0PONAHl37Kt6lJ4-BGTDfkMrguYfbvGdk-LbbVMq9fn1fVvM4j03LMFZrAmDZSBYXQchuwgVbaUviGNVb7wHlojRcBteSN1A4cMw0a7o0HX87I3d82IuLuc4gHN5x3AqRW1pTfZptNAw</recordid><startdate>200609</startdate><enddate>200609</enddate><creator>Ghiu, C.-D.</creator><creator>Dalmia, S.</creator><creator>Vickers, J.</creator><creator>Carastro, L.</creator><creator>Czakon, W.</creator><creator>Sundaram, V.</creator><creator>White, G.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200609</creationdate><title>Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates</title><author>Ghiu, C.-D. ; Dalmia, S. ; Vickers, J. ; Carastro, L. ; Czakon, W. ; Sundaram, V. ; White, G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6e8f117856f6e0c29feb0c5934db1b97df22fc8d4fe752b57a0a18be82d8d0d3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Crystallization</topic><topic>Diplexer</topic><topic>direct current</topic><topic>Inductors</topic><topic>IPD</topic><topic>Laminates</topic><topic>Liquid crystal polymers</topic><topic>Nonhomogeneous media</topic><topic>organics</topic><topic>Packaging</topic><topic>Radio frequency</topic><topic>Stability</topic><topic>substrate</topic><topic>Temperature distribution</topic><topic>Testing</topic><topic>thermal</topic><toplevel>online_resources</toplevel><creatorcontrib>Ghiu, C.-D.</creatorcontrib><creatorcontrib>Dalmia, S.</creatorcontrib><creatorcontrib>Vickers, J.</creatorcontrib><creatorcontrib>Carastro, L.</creatorcontrib><creatorcontrib>Czakon, W.</creatorcontrib><creatorcontrib>Sundaram, V.</creatorcontrib><creatorcontrib>White, G.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ghiu, C.-D.</au><au>Dalmia, S.</au><au>Vickers, J.</au><au>Carastro, L.</au><au>Czakon, W.</au><au>Sundaram, V.</au><au>White, G.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates</atitle><btitle>2006 European Microwave Integrated Circuits Conference</btitle><stitle>EMICC</stitle><date>2006-09</date><risdate>2006</risdate><spage>545</spage><epage>547</epage><pages>545-547</pages><isbn>9782960055184</isbn><isbn>2960055187</isbn><abstract>This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC</abstract><pub>IEEE</pub><doi>10.1109/EMICC.2006.282704</doi><tpages>3</tpages></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Crystallization Diplexer direct current Inductors IPD Laminates Liquid crystal polymers Nonhomogeneous media organics Packaging Radio frequency Stability substrate Temperature distribution Testing thermal |
| title | Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates |
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