Accurate alignment of laminate materials using sensor-based robot techniques
Assembly accuracies of 0.05-0.1 mm, needed for electronic product manufacture, are attainable with current automated manufacturing equipment. Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate...
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| creator | Brennemann, A.E. Hammer, R. Hollis, R.L. Jecusco, W.V. |
| description | Assembly accuracies of 0.05-0.1 mm, needed for electronic product manufacture, are attainable with current automated manufacturing equipment. Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate circuit boards requiring alignment accuracies of 7.5 /spl mu/m using existing automation equipment with enhancements and typical manufacturing line fixtures. The system, configured as a pilot workcell, consisted of an IBM 7576 coarse positioning robot, a fine positioning manipulator, an optical sensing system and a unique bracing method to reduce environmental disturbances. The strategy was to use a coarse/fine placement technique with sensing to align, stack and bond individual test laminates with patterns of 100 /spl mu/m holes. The results showed that pairs of holes were consistently aligned to 2-5 /spl mu/m which surpasses the 7.5 /spl mu/m manufacturing requirement.< > |
| doi_str_mv | 10.1109/ROBOT.1994.350947 |
| format | Conference Proceeding |
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Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate circuit boards requiring alignment accuracies of 7.5 /spl mu/m using existing automation equipment with enhancements and typical manufacturing line fixtures. The system, configured as a pilot workcell, consisted of an IBM 7576 coarse positioning robot, a fine positioning manipulator, an optical sensing system and a unique bracing method to reduce environmental disturbances. The strategy was to use a coarse/fine placement technique with sensing to align, stack and bond individual test laminates with patterns of 100 /spl mu/m holes. The results showed that pairs of holes were consistently aligned to 2-5 /spl mu/m which surpasses the 7.5 /spl mu/m manufacturing requirement.< ></description><identifier>ISBN: 0818653302</identifier><identifier>ISBN: 9780818653308</identifier><identifier>DOI: 10.1109/ROBOT.1994.350947</identifier><language>eng</language><publisher>IEEE Comput. Soc. Press</publisher><subject>Electronic equipment manufacture ; Fixtures ; Laminates ; Manipulators ; Manufacturing automation ; Optical sensors ; Printed circuits ; Robot sensing systems ; Robotic assembly ; Robotics and automation</subject><ispartof>Proceedings of the 1994 IEEE International Conference on Robotics and Automation, 1994, p.2273-2278 vol.3</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/350947$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,4035,4036,27904,54898</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/350947$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Brennemann, A.E.</creatorcontrib><creatorcontrib>Hammer, R.</creatorcontrib><creatorcontrib>Hollis, R.L.</creatorcontrib><creatorcontrib>Jecusco, W.V.</creatorcontrib><title>Accurate alignment of laminate materials using sensor-based robot techniques</title><title>Proceedings of the 1994 IEEE International Conference on Robotics and Automation</title><addtitle>ROBOT</addtitle><description>Assembly accuracies of 0.05-0.1 mm, needed for electronic product manufacture, are attainable with current automated manufacturing equipment. Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate circuit boards requiring alignment accuracies of 7.5 /spl mu/m using existing automation equipment with enhancements and typical manufacturing line fixtures. The system, configured as a pilot workcell, consisted of an IBM 7576 coarse positioning robot, a fine positioning manipulator, an optical sensing system and a unique bracing method to reduce environmental disturbances. The strategy was to use a coarse/fine placement technique with sensing to align, stack and bond individual test laminates with patterns of 100 /spl mu/m holes. The results showed that pairs of holes were consistently aligned to 2-5 /spl mu/m which surpasses the 7.5 /spl mu/m manufacturing requirement.< ></description><subject>Electronic equipment manufacture</subject><subject>Fixtures</subject><subject>Laminates</subject><subject>Manipulators</subject><subject>Manufacturing automation</subject><subject>Optical sensors</subject><subject>Printed circuits</subject><subject>Robot sensing systems</subject><subject>Robotic assembly</subject><subject>Robotics and automation</subject><isbn>0818653302</isbn><isbn>9780818653308</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1994</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj81KxDAcxAMiqOs-gJ7yAq1J03wd10VdoVCQ9bzk45810qaatAff3pV1DjPwYxgYhO4oqSkl-uGtf-z3NdW6rRknupUX6IYoqgRnjDRXaF3KJzmJcyWFvkbdxrklmxmwGeIxjZBmPAU8mDGmPzqeLEczFLyUmI64QCpTrqwp4HGe7DTjGdxHit8LlFt0GU5VWP_nCr0_P-23u6rrX163m66KVDZzFYRXhmtoiAUaWue8lcYK0ghvWw2aeu6NUY3S0puWSgZBMxBOChUsoYKt0P15NwLA4SvH0eSfw_kv-wWPFk2H</recordid><startdate>1994</startdate><enddate>1994</enddate><creator>Brennemann, A.E.</creator><creator>Hammer, R.</creator><creator>Hollis, R.L.</creator><creator>Jecusco, W.V.</creator><general>IEEE Comput. Soc. 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Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate circuit boards requiring alignment accuracies of 7.5 /spl mu/m using existing automation equipment with enhancements and typical manufacturing line fixtures. The system, configured as a pilot workcell, consisted of an IBM 7576 coarse positioning robot, a fine positioning manipulator, an optical sensing system and a unique bracing method to reduce environmental disturbances. The strategy was to use a coarse/fine placement technique with sensing to align, stack and bond individual test laminates with patterns of 100 /spl mu/m holes. The results showed that pairs of holes were consistently aligned to 2-5 /spl mu/m which surpasses the 7.5 /spl mu/m manufacturing requirement.< ></abstract><pub>IEEE Comput. Soc. Press</pub><doi>10.1109/ROBOT.1994.350947</doi></addata></record> |
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| identifier | ISBN: 0818653302 |
| ispartof | Proceedings of the 1994 IEEE International Conference on Robotics and Automation, 1994, p.2273-2278 vol.3 |
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| language | eng |
| recordid | cdi_ieee_primary_350947 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Electronic equipment manufacture Fixtures Laminates Manipulators Manufacturing automation Optical sensors Printed circuits Robot sensing systems Robotic assembly Robotics and automation |
| title | Accurate alignment of laminate materials using sensor-based robot techniques |
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