Effect of material interactions during thermal shock testing on IC package reliability

When large devices are molded in plastic, typically a low-stress epoxy compound is used together with a polyimide stress-relief coating. However, the interaction of these two materials, along with the die attach, is not well understood. Adverse interfacial effects on the plastic-encapsulated devices...

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Hauptverfasser:	Chen, A.S., Nguyen, L.T., Gee, S.A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Coatings Electric shock Integrated circuit packaging Integrated circuit testing Materials reliability Materials testing Microassembly Polyimides Semiconductor device packaging Thermal stresses
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creator	Chen, A.S. Nguyen, L.T. Gee, S.A.
description	When large devices are molded in plastic, typically a low-stress epoxy compound is used together with a polyimide stress-relief coating. However, the interaction of these two materials, along with the die attach, is not well understood. Adverse interfacial effects on the plastic-encapsulated devices can occur with the selection of the wrong combination of materials. With increasing die size, reliability becomes an important concern. Using the optimum combination of materials should provide the longest-lived packages. However, that combination is not known at this time. This study attempts at elucidating the interaction of three main material components in a plastic package: mold compound, die attach, and die coating.< >
doi_str_mv	10.1109/ECTC.1993.346774
format	Conference Proceeding
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This study attempts at elucidating the interaction of three main material components in a plastic package: mold compound, die attach, and die coating.< ></description><subject>Coatings</subject><subject>Electric shock</subject><subject>Integrated circuit packaging</subject><subject>Integrated circuit testing</subject><subject>Materials reliability</subject><subject>Materials testing</subject><subject>Microassembly</subject><subject>Polyimides</subject><subject>Semiconductor device packaging</subject><subject>Thermal stresses</subject><isbn>0780307941</isbn><isbn>9780780307940</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1993</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotT01LAzEUDIig1t7FU_7Arskm2WyOslQtFLxUr-Vt8tLG7kdJ4qH_3pV2LjPMPB4zhDxxVnLOzMuq3bYlN0aUQtZayxvywHTDBNNG8juyTOmHzVCqqVRzT75X3qPNdPJ0gIwxQE_DOAuwOUxjou43hnFP8wHjMGfpMNkjzZjyvzuNdN3SE9gj7JFG7AN0oQ_5_EhuPfQJl1dekK-31bb9KDaf7-v2dVMErqtcSKlrh97WFdROeN4obRthOjm3NcpbaXwtFLrKi_kIBCgFjXbaVtpZDZ1YkOfL34CIu1MMA8Tz7rJc_AEzyVAI</recordid><startdate>1993</startdate><enddate>1993</enddate><creator>Chen, A.S.</creator><creator>Nguyen, L.T.</creator><creator>Gee, S.A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1993</creationdate><title>Effect of material interactions during thermal shock testing on IC package reliability</title><author>Chen, A.S. ; Nguyen, L.T. ; Gee, S.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-4476defc62a6d3f1857c839b407995fc49f635ed2f3fc6a3a55a87d7c27dc7ab3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1993</creationdate><topic>Coatings</topic><topic>Electric shock</topic><topic>Integrated circuit packaging</topic><topic>Integrated circuit testing</topic><topic>Materials reliability</topic><topic>Materials testing</topic><topic>Microassembly</topic><topic>Polyimides</topic><topic>Semiconductor device packaging</topic><topic>Thermal stresses</topic><toplevel>online_resources</toplevel><creatorcontrib>Chen, A.S.</creatorcontrib><creatorcontrib>Nguyen, L.T.</creatorcontrib><creatorcontrib>Gee, S.A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, A.S.</au><au>Nguyen, L.T.</au><au>Gee, S.A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Effect of material interactions during thermal shock testing on IC package reliability</atitle><btitle>Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)</btitle><stitle>ECTC</stitle><date>1993</date><risdate>1993</risdate><spage>693</spage><epage>700</epage><pages>693-700</pages><isbn>0780307941</isbn><isbn>9780780307940</isbn><abstract>When large devices are molded in plastic, typically a low-stress epoxy compound is used together with a polyimide stress-relief coating. 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identifier	ISBN: 0780307941
ispartof	Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 1993, p.693-700
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Coatings Electric shock Integrated circuit packaging Integrated circuit testing Materials reliability Materials testing Microassembly Polyimides Semiconductor device packaging Thermal stresses
title	Effect of material interactions during thermal shock testing on IC package reliability
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