A fractal dimension feature extraction technique for detecting flaws in silicon wafers

A fractal dimension feature extraction technique for detecting flaws in silicon wafers

The authors present a feature extraction method for detecting flaws in silicon wafers based on the idea of fractal dimension. They begin by discussing why fractal dimension is a good way to model wafer surface images. They then describe how to calculate the fractal dimension of a computer image of a...

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Hauptverfasser: Stubbendieck, G.T., Oldham, W.J.B.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Data mining
Feature extraction
Fractals
Humans
Image segmentation
Inspection
Neural networks
Pattern recognition
Quality control
Silicon
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Oldham, W.J.B.
description The authors present a feature extraction method for detecting flaws in silicon wafers based on the idea of fractal dimension. They begin by discussing why fractal dimension is a good way to model wafer surface images. They then describe how to calculate the fractal dimension of a computer image of a wafer and how the results of such a calculation can be used for fault detection and image segmentation. The results of the application of this process to some wafer images are included.< >
doi_str_mv 10.1109/IJCNN.1992.227067
format Conference Proceeding
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subjects Data mining
Feature extraction
Fractals
Humans
Image segmentation
Inspection
Neural networks
Pattern recognition
Quality control
Silicon
title A fractal dimension feature extraction technique for detecting flaws in silicon wafers
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