Packaging of high density fiber/laser modules using passive alignment techniques
A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithogr...
Gespeichert in:
| Veröffentlicht in: | IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.944-955 |
|---|---|
| Hauptverfasser: | , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 955 |
|---|---|
| container_issue | 6 |
| container_start_page | 944 |
| container_title | IEEE transactions on components, hybrids, and manufacturing technology |
| container_volume | 15 |
| creator | Cohen, M.S. Cina, M.F. Bassous, E. Opyrsko, M.M. Speidell, J.L. Canora, F.J. DeFranza, M.J. |
| description | A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active alignment coupling efficiency was achieved. Details of the index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given.< > |
| doi_str_mv | 10.1109/33.206916 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_206916</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>206916</ieee_id><sourcerecordid>25795350</sourcerecordid><originalsourceid>FETCH-LOGICAL-c277t-f43829ceca311e397adc2718d392e82cce43328af92957b045d174f910aa3a23</originalsourceid><addsrcrecordid>eNo90DtrwzAUBWBRWmiadujaSVOhgxNdybKlsYS-INAM2YUiXztq_Uglu5B_3xiHTnc4H-fCIeQe2AKA6aUQC84yDdkFmYGUKhFM8UsyY5CqJEsBrslNjF-Mca4zNiObjXXftvJtRbuS7n21pwW20fdHWvodhmVtIwbadMVQY6RDHOXBxuh_kdraV22DbU97dPvW_wwYb8lVaeuId-c7J9vXl-3qPVl_vn2snteJ43neJ2UqFNcOnRUAKHRui1MAqhCao-LOYSoEV7bUXMt8x1JZQJ6WGpi1wnIxJ49T7SF049veND46rGvbYjdEw2WupZDsBJ8m6EIXY8DSHIJvbDgaYGaczAhhpslO9mGyHhH_3Tn8AxiOZqg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>25795350</pqid></control><display><type>article</type><title>Packaging of high density fiber/laser modules using passive alignment techniques</title><source>IEEE Electronic Library (IEL)</source><creator>Cohen, M.S. ; Cina, M.F. ; Bassous, E. ; Opyrsko, M.M. ; Speidell, J.L. ; Canora, F.J. ; DeFranza, M.J.</creator><creatorcontrib>Cohen, M.S. ; Cina, M.F. ; Bassous, E. ; Opyrsko, M.M. ; Speidell, J.L. ; Canora, F.J. ; DeFranza, M.J.</creatorcontrib><description>A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active alignment coupling efficiency was achieved. Details of the index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given.< ></description><identifier>ISSN: 0148-6411</identifier><identifier>EISSN: 1558-3082</identifier><identifier>DOI: 10.1109/33.206916</identifier><identifier>CODEN: ITTEDR</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aging ; Costs ; Fiber lasers ; Laser modes ; Lenses ; Lithography ; Optical coupling ; Optical transmitters ; Packaging ; Power lasers</subject><ispartof>IEEE transactions on components, hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.944-955</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c277t-f43829ceca311e397adc2718d392e82cce43328af92957b045d174f910aa3a23</citedby><cites>FETCH-LOGICAL-c277t-f43829ceca311e397adc2718d392e82cce43328af92957b045d174f910aa3a23</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/206916$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/206916$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Cohen, M.S.</creatorcontrib><creatorcontrib>Cina, M.F.</creatorcontrib><creatorcontrib>Bassous, E.</creatorcontrib><creatorcontrib>Opyrsko, M.M.</creatorcontrib><creatorcontrib>Speidell, J.L.</creatorcontrib><creatorcontrib>Canora, F.J.</creatorcontrib><creatorcontrib>DeFranza, M.J.</creatorcontrib><title>Packaging of high density fiber/laser modules using passive alignment techniques</title><title>IEEE transactions on components, hybrids, and manufacturing technology</title><addtitle>T-CHMT</addtitle><description>A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active alignment coupling efficiency was achieved. Details of the index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given.< ></description><subject>Aging</subject><subject>Costs</subject><subject>Fiber lasers</subject><subject>Laser modes</subject><subject>Lenses</subject><subject>Lithography</subject><subject>Optical coupling</subject><subject>Optical transmitters</subject><subject>Packaging</subject><subject>Power lasers</subject><issn>0148-6411</issn><issn>1558-3082</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1992</creationdate><recordtype>article</recordtype><recordid>eNo90DtrwzAUBWBRWmiadujaSVOhgxNdybKlsYS-INAM2YUiXztq_Uglu5B_3xiHTnc4H-fCIeQe2AKA6aUQC84yDdkFmYGUKhFM8UsyY5CqJEsBrslNjF-Mca4zNiObjXXftvJtRbuS7n21pwW20fdHWvodhmVtIwbadMVQY6RDHOXBxuh_kdraV22DbU97dPvW_wwYb8lVaeuId-c7J9vXl-3qPVl_vn2snteJ43neJ2UqFNcOnRUAKHRui1MAqhCao-LOYSoEV7bUXMt8x1JZQJ6WGpi1wnIxJ49T7SF049veND46rGvbYjdEw2WupZDsBJ8m6EIXY8DSHIJvbDgaYGaczAhhpslO9mGyHhH_3Tn8AxiOZqg</recordid><startdate>19921201</startdate><enddate>19921201</enddate><creator>Cohen, M.S.</creator><creator>Cina, M.F.</creator><creator>Bassous, E.</creator><creator>Opyrsko, M.M.</creator><creator>Speidell, J.L.</creator><creator>Canora, F.J.</creator><creator>DeFranza, M.J.</creator><general>IEEE</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>19921201</creationdate><title>Packaging of high density fiber/laser modules using passive alignment techniques</title><author>Cohen, M.S. ; Cina, M.F. ; Bassous, E. ; Opyrsko, M.M. ; Speidell, J.L. ; Canora, F.J. ; DeFranza, M.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c277t-f43829ceca311e397adc2718d392e82cce43328af92957b045d174f910aa3a23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1992</creationdate><topic>Aging</topic><topic>Costs</topic><topic>Fiber lasers</topic><topic>Laser modes</topic><topic>Lenses</topic><topic>Lithography</topic><topic>Optical coupling</topic><topic>Optical transmitters</topic><topic>Packaging</topic><topic>Power lasers</topic><toplevel>online_resources</toplevel><creatorcontrib>Cohen, M.S.</creatorcontrib><creatorcontrib>Cina, M.F.</creatorcontrib><creatorcontrib>Bassous, E.</creatorcontrib><creatorcontrib>Opyrsko, M.M.</creatorcontrib><creatorcontrib>Speidell, J.L.</creatorcontrib><creatorcontrib>Canora, F.J.</creatorcontrib><creatorcontrib>DeFranza, M.J.</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Cohen, M.S.</au><au>Cina, M.F.</au><au>Bassous, E.</au><au>Opyrsko, M.M.</au><au>Speidell, J.L.</au><au>Canora, F.J.</au><au>DeFranza, M.J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Packaging of high density fiber/laser modules using passive alignment techniques</atitle><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle><stitle>T-CHMT</stitle><date>1992-12-01</date><risdate>1992</risdate><volume>15</volume><issue>6</issue><spage>944</spage><epage>955</epage><pages>944-955</pages><issn>0148-6411</issn><eissn>1558-3082</eissn><coden>ITTEDR</coden><abstract>A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a passive method based on the registration principles of photolithography. The method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it was possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active alignment coupling efficiency was achieved. Details of the index-alignment method are discussed, and a brief description of an improved computer-controlled version of the apparatus is given.< ></abstract><pub>IEEE</pub><doi>10.1109/33.206916</doi><tpages>12</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0148-6411 |
| ispartof | IEEE transactions on components, hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.944-955 |
| issn | 0148-6411 1558-3082 |
| language | eng |
| recordid | cdi_ieee_primary_206916 |
| source | IEEE Electronic Library (IEL) |
| subjects | Aging Costs Fiber lasers Laser modes Lenses Lithography Optical coupling Optical transmitters Packaging Power lasers |
| title | Packaging of high density fiber/laser modules using passive alignment techniques |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T04%3A50%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Packaging%20of%20high%20density%20fiber/laser%20modules%20using%20passive%20alignment%20techniques&rft.jtitle=IEEE%20transactions%20on%20components,%20hybrids,%20and%20manufacturing%20technology&rft.au=Cohen,%20M.S.&rft.date=1992-12-01&rft.volume=15&rft.issue=6&rft.spage=944&rft.epage=955&rft.pages=944-955&rft.issn=0148-6411&rft.eissn=1558-3082&rft.coden=ITTEDR&rft_id=info:doi/10.1109/33.206916&rft_dat=%3Cproquest_RIE%3E25795350%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=25795350&rft_id=info:pmid/&rft_ieee_id=206916&rfr_iscdi=true |