High-temperature integration of silicon carbide (SiC) and silicon-on-insulator (SOI) electronics in multichip power modules (MCPMs)

Arkansas Power Electronics International, Inc, (APEI, Inc.) and University of Arkansas researchers have developed a novel, highly miniaturized motor drive capable of operation in excess of 250 degC. The high-temperature multichip power module (MCPM) integrates silicon carbide (SiC) JFET power transi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hornberger, J., Mounce, S., Schupbach, R., McPherson, B., Mustain, H., Mantooth, A., Brown, W., Lostetter, A.B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electronic packaging thermal management Fabrication High-temperature electronics High-temperature packaging Microassembly Motor drives Multichip modules Power electronics Power transistors Prototypes Silicon carbide Silicon carbide (SiC) Silicon on Insulator (SOI) Silicon on insulator technology
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