Electrical characteristics of single buried microstrip lines in the TEM approximation

Electrical characteristics of single buried microstrip lines in the TEM approximation

Several design parameters for the analysis of the performance of buried microstrip-like interconnect geometries under the assumption of TEM-mode wave propagation are examined. Electrical characteristics of buried microstrip are investigated over a wide range of practical values of material parameter...

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Veröffentlicht in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1988-09, Vol.11 (3), p.279-283
Hauptverfasser: Prince, J.L., Santhinathan, R., Palusinski, O.A., Scheinfein, M.R.
Format: Artikel
Sprache:eng
Schlagworte:
Capacitance
Dielectric losses
Dielectric substrates
Electric variables
Geometry
Impedance
Integrated circuit interconnections
Laplace equations
Microstrip
Packaging
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Beschreibung
Zusammenfassung:Several design parameters for the analysis of the performance of buried microstrip-like interconnect geometries under the assumption of TEM-mode wave propagation are examined. Electrical characteristics of buried microstrip are investigated over a wide range of practical values of material parameters and geometries. The result is a set of curves which can be used for substrate design for a wide range of dielectric constants and for a variety of practical geometries.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.16654