Ultrawideband design challenges for wireless chip-to-chip communications and interconnects

The ever growing demand for on-board space craft processing combined with the exponential advance in chip development and high pin count devices is resulting in an increased complexity in high reliability interconnect technology. When the thermal management, control of ground bounce, and power distr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Celebi, H., Sahin, M.E., Arslan, H., Haque, J., Prado, E.R., Markell, D.P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page 8 pp.
container_title
container_volume
creator Celebi, H.
Sahin, M.E.
Arslan, H.
Haque, J.
Prado, E.R.
Markell, D.P.
description The ever growing demand for on-board space craft processing combined with the exponential advance in chip development and high pin count devices is resulting in an increased complexity in high reliability interconnect technology. When the thermal management, control of ground bounce, and power distribution issues are considered, achieving the required reliability levels for space applications with traditional interconnect technologies is becoming more of a concern. As an alternative solution, an ultrawideband (UWB) based high speed wireless method for chip to chip as well as off-board communications can be considered. Such approach would reduce the high pin count connectors and interconnects between complex components. UWB with its simple transceiver architecture, low power consumption, and high data rate within short ranges is shown to be the best candidate for the applications targeted. This paper explores the design challenges for developing a test-bed using commercial off-the-shelf (COTS) components that will be used to prove the concept of wireless chip-to-chip communications and develop associated algorithms. Energy detector based UWB transceiver is presented in this paper and our study shows the feasibility of implementation such transceiver using COTS components. The UWB transceivers will eventually be integrated into a chip eliminating the need for many of the high speed interface specific applications, and decreasing the number of the pin fields required
doi_str_mv 10.1109/AERO.2006.1655952
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1655952</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1655952</ieee_id><sourcerecordid>1655952</sourcerecordid><originalsourceid>FETCH-LOGICAL-i1332-3e5d65924d13bcb45ff5c040b71401a2d69d07becc11fadd95b9b64bd7d243eb3</originalsourceid><addsrcrecordid>eNotkNtKw0AYhBcPYKh5APEmL7BxT3_SvSylWqFQEAviTdnDn7qSbEo2Unx7U-wwMDDwzcUQ8sBZyTnTT4vV27YUjFUlrwA0iCuSCa0rKiTMr0mu6zmbLDUo0DckmxigUsiPO5Kn9M0mKVBSqIx87tpxMKfg0ZroC48pHGLhvkzbYjxgKpp-KE5hwBZTmvpwpGNPz1m4vut-YnBmDH1MxRkPccTB9TGiG9M9uW1MmzC_5IzsnlfvyzXdbF9el4sNDVxKQSWCr0AL5bm0zipoGnBMMVtzxbgRvtKe1Rad47wx3muw2lbK-toLJdHKGXn83w2IuD8OoTPD7_7yjPwDD_1XQw</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Ultrawideband design challenges for wireless chip-to-chip communications and interconnects</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Celebi, H. ; Sahin, M.E. ; Arslan, H. ; Haque, J. ; Prado, E.R. ; Markell, D.P.</creator><creatorcontrib>Celebi, H. ; Sahin, M.E. ; Arslan, H. ; Haque, J. ; Prado, E.R. ; Markell, D.P.</creatorcontrib><description>The ever growing demand for on-board space craft processing combined with the exponential advance in chip development and high pin count devices is resulting in an increased complexity in high reliability interconnect technology. When the thermal management, control of ground bounce, and power distribution issues are considered, achieving the required reliability levels for space applications with traditional interconnect technologies is becoming more of a concern. As an alternative solution, an ultrawideband (UWB) based high speed wireless method for chip to chip as well as off-board communications can be considered. Such approach would reduce the high pin count connectors and interconnects between complex components. UWB with its simple transceiver architecture, low power consumption, and high data rate within short ranges is shown to be the best candidate for the applications targeted. This paper explores the design challenges for developing a test-bed using commercial off-the-shelf (COTS) components that will be used to prove the concept of wireless chip-to-chip communications and develop associated algorithms. Energy detector based UWB transceiver is presented in this paper and our study shows the feasibility of implementation such transceiver using COTS components. The UWB transceivers will eventually be integrated into a chip eliminating the need for many of the high speed interface specific applications, and decreasing the number of the pin fields required</description><identifier>ISSN: 1095-323X</identifier><identifier>ISBN: 9780780395459</identifier><identifier>ISBN: 078039545X</identifier><identifier>EISSN: 2996-2358</identifier><identifier>DOI: 10.1109/AERO.2006.1655952</identifier><language>eng</language><publisher>IEEE</publisher><subject>Chip scale packaging ; Communication system control ; Energy management ; Power distribution ; Space technology ; Technology management ; Thermal management ; Transceivers ; Ultra wideband technology ; Wireless communication</subject><ispartof>2006 IEEE Aerospace Conference, 2006, p.8 pp.</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1655952$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1655952$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Celebi, H.</creatorcontrib><creatorcontrib>Sahin, M.E.</creatorcontrib><creatorcontrib>Arslan, H.</creatorcontrib><creatorcontrib>Haque, J.</creatorcontrib><creatorcontrib>Prado, E.R.</creatorcontrib><creatorcontrib>Markell, D.P.</creatorcontrib><title>Ultrawideband design challenges for wireless chip-to-chip communications and interconnects</title><title>2006 IEEE Aerospace Conference</title><addtitle>AERO</addtitle><description>The ever growing demand for on-board space craft processing combined with the exponential advance in chip development and high pin count devices is resulting in an increased complexity in high reliability interconnect technology. When the thermal management, control of ground bounce, and power distribution issues are considered, achieving the required reliability levels for space applications with traditional interconnect technologies is becoming more of a concern. As an alternative solution, an ultrawideband (UWB) based high speed wireless method for chip to chip as well as off-board communications can be considered. Such approach would reduce the high pin count connectors and interconnects between complex components. UWB with its simple transceiver architecture, low power consumption, and high data rate within short ranges is shown to be the best candidate for the applications targeted. This paper explores the design challenges for developing a test-bed using commercial off-the-shelf (COTS) components that will be used to prove the concept of wireless chip-to-chip communications and develop associated algorithms. Energy detector based UWB transceiver is presented in this paper and our study shows the feasibility of implementation such transceiver using COTS components. The UWB transceivers will eventually be integrated into a chip eliminating the need for many of the high speed interface specific applications, and decreasing the number of the pin fields required</description><subject>Chip scale packaging</subject><subject>Communication system control</subject><subject>Energy management</subject><subject>Power distribution</subject><subject>Space technology</subject><subject>Technology management</subject><subject>Thermal management</subject><subject>Transceivers</subject><subject>Ultra wideband technology</subject><subject>Wireless communication</subject><issn>1095-323X</issn><issn>2996-2358</issn><isbn>9780780395459</isbn><isbn>078039545X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkNtKw0AYhBcPYKh5APEmL7BxT3_SvSylWqFQEAviTdnDn7qSbEo2Unx7U-wwMDDwzcUQ8sBZyTnTT4vV27YUjFUlrwA0iCuSCa0rKiTMr0mu6zmbLDUo0DckmxigUsiPO5Kn9M0mKVBSqIx87tpxMKfg0ZroC48pHGLhvkzbYjxgKpp-KE5hwBZTmvpwpGNPz1m4vut-YnBmDH1MxRkPccTB9TGiG9M9uW1MmzC_5IzsnlfvyzXdbF9el4sNDVxKQSWCr0AL5bm0zipoGnBMMVtzxbgRvtKe1Rad47wx3muw2lbK-toLJdHKGXn83w2IuD8OoTPD7_7yjPwDD_1XQw</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Celebi, H.</creator><creator>Sahin, M.E.</creator><creator>Arslan, H.</creator><creator>Haque, J.</creator><creator>Prado, E.R.</creator><creator>Markell, D.P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2006</creationdate><title>Ultrawideband design challenges for wireless chip-to-chip communications and interconnects</title><author>Celebi, H. ; Sahin, M.E. ; Arslan, H. ; Haque, J. ; Prado, E.R. ; Markell, D.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i1332-3e5d65924d13bcb45ff5c040b71401a2d69d07becc11fadd95b9b64bd7d243eb3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Chip scale packaging</topic><topic>Communication system control</topic><topic>Energy management</topic><topic>Power distribution</topic><topic>Space technology</topic><topic>Technology management</topic><topic>Thermal management</topic><topic>Transceivers</topic><topic>Ultra wideband technology</topic><topic>Wireless communication</topic><toplevel>online_resources</toplevel><creatorcontrib>Celebi, H.</creatorcontrib><creatorcontrib>Sahin, M.E.</creatorcontrib><creatorcontrib>Arslan, H.</creatorcontrib><creatorcontrib>Haque, J.</creatorcontrib><creatorcontrib>Prado, E.R.</creatorcontrib><creatorcontrib>Markell, D.P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Celebi, H.</au><au>Sahin, M.E.</au><au>Arslan, H.</au><au>Haque, J.</au><au>Prado, E.R.</au><au>Markell, D.P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Ultrawideband design challenges for wireless chip-to-chip communications and interconnects</atitle><btitle>2006 IEEE Aerospace Conference</btitle><stitle>AERO</stitle><date>2006</date><risdate>2006</risdate><spage>8 pp.</spage><pages>8 pp.-</pages><issn>1095-323X</issn><eissn>2996-2358</eissn><isbn>9780780395459</isbn><isbn>078039545X</isbn><abstract>The ever growing demand for on-board space craft processing combined with the exponential advance in chip development and high pin count devices is resulting in an increased complexity in high reliability interconnect technology. When the thermal management, control of ground bounce, and power distribution issues are considered, achieving the required reliability levels for space applications with traditional interconnect technologies is becoming more of a concern. As an alternative solution, an ultrawideband (UWB) based high speed wireless method for chip to chip as well as off-board communications can be considered. Such approach would reduce the high pin count connectors and interconnects between complex components. UWB with its simple transceiver architecture, low power consumption, and high data rate within short ranges is shown to be the best candidate for the applications targeted. This paper explores the design challenges for developing a test-bed using commercial off-the-shelf (COTS) components that will be used to prove the concept of wireless chip-to-chip communications and develop associated algorithms. Energy detector based UWB transceiver is presented in this paper and our study shows the feasibility of implementation such transceiver using COTS components. The UWB transceivers will eventually be integrated into a chip eliminating the need for many of the high speed interface specific applications, and decreasing the number of the pin fields required</abstract><pub>IEEE</pub><doi>10.1109/AERO.2006.1655952</doi><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1095-323X
ispartof 2006 IEEE Aerospace Conference, 2006, p.8 pp.
issn 1095-323X
2996-2358
language eng
recordid cdi_ieee_primary_1655952
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Chip scale packaging
Communication system control
Energy management
Power distribution
Space technology
Technology management
Thermal management
Transceivers
Ultra wideband technology
Wireless communication
title Ultrawideband design challenges for wireless chip-to-chip communications and interconnects
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T18%3A44%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Ultrawideband%20design%20challenges%20for%20wireless%20chip-to-chip%20communications%20and%20interconnects&rft.btitle=2006%20IEEE%20Aerospace%20Conference&rft.au=Celebi,%20H.&rft.date=2006&rft.spage=8%20pp.&rft.pages=8%20pp.-&rft.issn=1095-323X&rft.eissn=2996-2358&rft.isbn=9780780395459&rft.isbn_list=078039545X&rft_id=info:doi/10.1109/AERO.2006.1655952&rft_dat=%3Cieee_6IE%3E1655952%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1655952&rfr_iscdi=true