MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB

Over the past 30 years, IBM has provided leadership in high density I/O density and count interconnects at both chip and package levels as has been necessary for processor chips in high end symmetrical multiple processor (SMP) servers. For example, IBM introduced multi-chip modules (MCMs) in the 197...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Libsch, F.R., Budd, R., Chiniwalla, P., Hobbs, P.C.D., Mastro, M., Sanford, J.L., Xu, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bandwidth Bonding Integrated circuit interconnections Optical devices Optical interconnections Optical polymers Optical waveguides Packaging Printed circuits Thermal conductivity
Online-Zugang:	Volltext bestellen
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