Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards
Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in...
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| creator | Ege Engin, A. Bharath, K. Swaminathan, M. Cases, M. Mutnury, B. Pham, N. de Araujo, D.N. Matoglu, E. |
| description | Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. This method allows considering realistic structures, which would be prohibitive to simulate using full-wave simulators |
| doi_str_mv | 10.1109/ECTC.2006.1645815 |
| format | Conference Proceeding |
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There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. 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This method allows considering realistic structures, which would be prohibitive to simulate using full-wave simulators</description><subject>Apertures</subject><subject>Circuit noise</subject><subject>Coupling circuits</subject><subject>Electromagnetic interference</subject><subject>Finite difference methods</subject><subject>Packaging</subject><subject>Power demand</subject><subject>Power distribution</subject><subject>Semiconductor device noise</subject><subject>Voltage</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>1424401526</isbn><isbn>9781424401529</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkMtqwzAUREUf0DTNB5Ru9ANOdCXrSloWk7SFQDfpOsjWdVDryMZ2CPn7mjargTPDWQxjzyCWAMKt1sWuWEohcAmYawv6hs2kMibTRuIte4Rc5rkALfGOzYRGl2kt1ANbDMO3EAIcWrR2xppNTHGkLMS6pp5SRfzYBmpiOvC25qmNA_GqPXV_pKTxTJR4156pXx369pQC7xqfaOAx8eOpGWPjL5Nowr768Yep8NOmbH0fhid2X_tmoMU15-xrs94V79n28-2jeN1mEYwes7JELFEY4QwAoAmqdGCclxQsGOMMlRryKniNdWUrdM4K6xUppxAlVmrOXv69kYj2XR-Pvr_sr0epX9tUW4U</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Ege Engin, A.</creator><creator>Bharath, K.</creator><creator>Swaminathan, M.</creator><creator>Cases, M.</creator><creator>Mutnury, B.</creator><creator>Pham, N.</creator><creator>de Araujo, D.N.</creator><creator>Matoglu, E.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2006</creationdate><title>Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards</title><author>Ege Engin, A. ; Bharath, K. ; Swaminathan, M. ; Cases, M. ; Mutnury, B. ; Pham, N. ; de Araujo, D.N. ; Matoglu, E.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-bb66b60709711167d3b9179a2ed817797eb514cda56fc8c699808a3e3936626c3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Apertures</topic><topic>Circuit noise</topic><topic>Coupling circuits</topic><topic>Electromagnetic interference</topic><topic>Finite difference methods</topic><topic>Packaging</topic><topic>Power demand</topic><topic>Power distribution</topic><topic>Semiconductor device noise</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Ege Engin, A.</creatorcontrib><creatorcontrib>Bharath, K.</creatorcontrib><creatorcontrib>Swaminathan, M.</creatorcontrib><creatorcontrib>Cases, M.</creatorcontrib><creatorcontrib>Mutnury, B.</creatorcontrib><creatorcontrib>Pham, N.</creatorcontrib><creatorcontrib>de Araujo, D.N.</creatorcontrib><creatorcontrib>Matoglu, E.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ege Engin, A.</au><au>Bharath, K.</au><au>Swaminathan, M.</au><au>Cases, M.</au><au>Mutnury, B.</au><au>Pham, N.</au><au>de Araujo, D.N.</au><au>Matoglu, E.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards</atitle><btitle>56th Electronic Components and Technology Conference 2006</btitle><stitle>ECTC</stitle><date>2006</date><risdate>2006</risdate><spage>6 pp.</spage><pages>6 pp.-</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>1424401526</isbn><isbn>9781424401529</isbn><abstract>Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. 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| identifier | ISSN: 0569-5503 |
| ispartof | 56th Electronic Components and Technology Conference 2006, 2006, p.6 pp. |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_1645815 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Apertures Circuit noise Coupling circuits Electromagnetic interference Finite difference methods Packaging Power demand Power distribution Semiconductor device noise Voltage |
| title | Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards |
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