Assembly challenges of high density large fine pitch lead-free flip chip package

Assembly challenges for a high density, high performance integrated circuit package have been studied with respect to leadfree solder, fine pitch, large die on an organic substrate. The stresses induced by the large die size, higher reflow temperature due to lead-free solder and the low solder stand...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ser Choong Chong, Yeow Meng Tan, Tai Chong Chai, Lim, S., Wai Yin Hnin, Chek Kweng Chen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Assembly Conducting materials Environmentally friendly manufacturing techniques Flip chip Integrated circuit packaging Lead Materials reliability Silicon Stress
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