The reliability study of laser trimmed resistor components

A process model was established to understand the formation of stresses within the silica overlayer using TFR (thin-film resistor) laser trimming. The stresses were calculated using a thermal inclusion model. The stress resulting from laser trim created delaminations lead to cone crack formation. Th...

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Bibliographische Detailangaben

Hauptverfasser:	Huang, Y., Cook, R.F., Smith, W.F.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Ceramics Delamination Insulation Laser stability Morphology Resistors Semiconductor thin films Silicon compounds Stress Substrates
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