Post Implant Strip Optimization for 90nm and Beyond Technologies

Optical emission spectroscopy, SEM, and SIMS were used to analyze the modified layer formed during exposure of resist materials to ion implant conditions and to characterize the removal rate of this modified layer upon exposure to various plasma strip chemistries on commercial strip tools. This meth...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Fuller, N.C.M., Santiago, A., Mello, K., Chienfan Yu, Molis, S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 291
container_issue
container_start_page 289
container_title
container_volume
creator Fuller, N.C.M.
Santiago, A.
Mello, K.
Chienfan Yu
Molis, S.
description Optical emission spectroscopy, SEM, and SIMS were used to analyze the modified layer formed during exposure of resist materials to ion implant conditions and to characterize the removal rate of this modified layer upon exposure to various plasma strip chemistries on commercial strip tools. This methodology was used to evaluate candidate strip chemistries for reducing post implant strip defectivity and increasing device functional yield
doi_str_mv 10.1109/ASMC.2006.1638770
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1638770</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1638770</ieee_id><sourcerecordid>1638770</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-92f9fa8feafaeec0d27ed0140c91de9ed657e4466867f588a1cbdff23d601fae3</originalsourceid><addsrcrecordid>eNotj8tOwzAUBS0eElHJByA2_oGUa8fxY0eJKFQqKlLLujLxNRglcZR4U76eSHQ2s5ojHULuGCwZA_Ow2r_VSw4gl0yWWim4IBkvlSykNOqS5EZpJrgQwCsBVyRjoHShlShvSD5NPzAjKsGVzsjje5wS3XRDa_tE92kMA90NKXTh16YQe-rjSA30HbW9o094irMO2Hz3sY1fAadbcu1tO2F-9oJ8rJ8P9Wux3b1s6tW2CExVqTDcG2-1R-stYgOOK3TABDSGOTToZKVQCCm1VL7S2rLm03nPSyeBzUm5IPf_uwERj8MYOjuejuf_5R-t-0zs</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Post Implant Strip Optimization for 90nm and Beyond Technologies</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Fuller, N.C.M. ; Santiago, A. ; Mello, K. ; Chienfan Yu ; Molis, S.</creator><creatorcontrib>Fuller, N.C.M. ; Santiago, A. ; Mello, K. ; Chienfan Yu ; Molis, S.</creatorcontrib><description>Optical emission spectroscopy, SEM, and SIMS were used to analyze the modified layer formed during exposure of resist materials to ion implant conditions and to characterize the removal rate of this modified layer upon exposure to various plasma strip chemistries on commercial strip tools. This methodology was used to evaluate candidate strip chemistries for reducing post implant strip defectivity and increasing device functional yield</description><identifier>ISSN: 1078-8743</identifier><identifier>ISBN: 9781424402540</identifier><identifier>ISBN: 1424402549</identifier><identifier>EISSN: 2376-6697</identifier><identifier>DOI: 10.1109/ASMC.2006.1638770</identifier><language>eng</language><publisher>IEEE</publisher><subject>Chemical technology ; Implants ; Optical materials ; Particle beam optics ; Plasma applications ; Plasma chemistry ; Resists ; Spectroscopy ; Stimulated emission ; Strips</subject><ispartof>The 17th Annual SEMI/IEEE ASMC 2006 Conference, 2006, p.289-291</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1638770$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1638770$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Fuller, N.C.M.</creatorcontrib><creatorcontrib>Santiago, A.</creatorcontrib><creatorcontrib>Mello, K.</creatorcontrib><creatorcontrib>Chienfan Yu</creatorcontrib><creatorcontrib>Molis, S.</creatorcontrib><title>Post Implant Strip Optimization for 90nm and Beyond Technologies</title><title>The 17th Annual SEMI/IEEE ASMC 2006 Conference</title><addtitle>ASMC</addtitle><description>Optical emission spectroscopy, SEM, and SIMS were used to analyze the modified layer formed during exposure of resist materials to ion implant conditions and to characterize the removal rate of this modified layer upon exposure to various plasma strip chemistries on commercial strip tools. This methodology was used to evaluate candidate strip chemistries for reducing post implant strip defectivity and increasing device functional yield</description><subject>Chemical technology</subject><subject>Implants</subject><subject>Optical materials</subject><subject>Particle beam optics</subject><subject>Plasma applications</subject><subject>Plasma chemistry</subject><subject>Resists</subject><subject>Spectroscopy</subject><subject>Stimulated emission</subject><subject>Strips</subject><issn>1078-8743</issn><issn>2376-6697</issn><isbn>9781424402540</isbn><isbn>1424402549</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tOwzAUBS0eElHJByA2_oGUa8fxY0eJKFQqKlLLujLxNRglcZR4U76eSHQ2s5ojHULuGCwZA_Ow2r_VSw4gl0yWWim4IBkvlSykNOqS5EZpJrgQwCsBVyRjoHShlShvSD5NPzAjKsGVzsjje5wS3XRDa_tE92kMA90NKXTh16YQe-rjSA30HbW9o094irMO2Hz3sY1fAadbcu1tO2F-9oJ8rJ8P9Wux3b1s6tW2CExVqTDcG2-1R-stYgOOK3TABDSGOTToZKVQCCm1VL7S2rLm03nPSyeBzUm5IPf_uwERj8MYOjuejuf_5R-t-0zs</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Fuller, N.C.M.</creator><creator>Santiago, A.</creator><creator>Mello, K.</creator><creator>Chienfan Yu</creator><creator>Molis, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2006</creationdate><title>Post Implant Strip Optimization for 90nm and Beyond Technologies</title><author>Fuller, N.C.M. ; Santiago, A. ; Mello, K. ; Chienfan Yu ; Molis, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-92f9fa8feafaeec0d27ed0140c91de9ed657e4466867f588a1cbdff23d601fae3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Chemical technology</topic><topic>Implants</topic><topic>Optical materials</topic><topic>Particle beam optics</topic><topic>Plasma applications</topic><topic>Plasma chemistry</topic><topic>Resists</topic><topic>Spectroscopy</topic><topic>Stimulated emission</topic><topic>Strips</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fuller, N.C.M.</creatorcontrib><creatorcontrib>Santiago, A.</creatorcontrib><creatorcontrib>Mello, K.</creatorcontrib><creatorcontrib>Chienfan Yu</creatorcontrib><creatorcontrib>Molis, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fuller, N.C.M.</au><au>Santiago, A.</au><au>Mello, K.</au><au>Chienfan Yu</au><au>Molis, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Post Implant Strip Optimization for 90nm and Beyond Technologies</atitle><btitle>The 17th Annual SEMI/IEEE ASMC 2006 Conference</btitle><stitle>ASMC</stitle><date>2006</date><risdate>2006</risdate><spage>289</spage><epage>291</epage><pages>289-291</pages><issn>1078-8743</issn><eissn>2376-6697</eissn><isbn>9781424402540</isbn><isbn>1424402549</isbn><abstract>Optical emission spectroscopy, SEM, and SIMS were used to analyze the modified layer formed during exposure of resist materials to ion implant conditions and to characterize the removal rate of this modified layer upon exposure to various plasma strip chemistries on commercial strip tools. This methodology was used to evaluate candidate strip chemistries for reducing post implant strip defectivity and increasing device functional yield</abstract><pub>IEEE</pub><doi>10.1109/ASMC.2006.1638770</doi><tpages>3</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1078-8743
ispartof The 17th Annual SEMI/IEEE ASMC 2006 Conference, 2006, p.289-291
issn 1078-8743
2376-6697
language eng
recordid cdi_ieee_primary_1638770
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Chemical technology
Implants
Optical materials
Particle beam optics
Plasma applications
Plasma chemistry
Resists
Spectroscopy
Stimulated emission
Strips
title Post Implant Strip Optimization for 90nm and Beyond Technologies
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T07%3A52%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Post%20Implant%20Strip%20Optimization%20for%2090nm%20and%20Beyond%20Technologies&rft.btitle=The%2017th%20Annual%20SEMI/IEEE%20ASMC%202006%20Conference&rft.au=Fuller,%20N.C.M.&rft.date=2006&rft.spage=289&rft.epage=291&rft.pages=289-291&rft.issn=1078-8743&rft.eissn=2376-6697&rft.isbn=9781424402540&rft.isbn_list=1424402549&rft_id=info:doi/10.1109/ASMC.2006.1638770&rft_dat=%3Cieee_6IE%3E1638770%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1638770&rfr_iscdi=true