Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages

In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pair...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Weiliang Yuan, Kuah Hsian Pang, Wang Chuen Khiang, Desmond Chong Yok Rue, Daengdora, M.A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Crosstalk Degradation Dielectrics Electronics packaging Frequency Impedance Microstrip Stripline Transmission line discontinuities Transmission lines
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!