Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages
In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pair...
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| creator | Weiliang Yuan Kuah Hsian Pang Wang Chuen Khiang Desmond Chong Yok Rue Daengdora, M.A. |
| description | In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design |
| doi_str_mv | 10.1109/EMCZUR.2006.215000 |
| format | Conference Proceeding |
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The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design</description><identifier>ISBN: 9783952299036</identifier><identifier>ISBN: 3952299030</identifier><identifier>DOI: 10.1109/EMCZUR.2006.215000</identifier><language>eng</language><publisher>IEEE</publisher><subject>Crosstalk ; Degradation ; Dielectrics ; Electronics packaging ; Frequency ; Impedance ; Microstrip ; Stripline ; Transmission line discontinuities ; Transmission lines</subject><ispartof>2006 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, p.578-581</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1629690$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4047,4048,27923,54918</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1629690$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Weiliang Yuan</creatorcontrib><creatorcontrib>Kuah Hsian Pang</creatorcontrib><creatorcontrib>Wang Chuen Khiang</creatorcontrib><creatorcontrib>Desmond Chong Yok Rue</creatorcontrib><creatorcontrib>Daengdora, M.A.</creatorcontrib><title>Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages</title><title>2006 17th International Zurich Symposium on Electromagnetic Compatibility</title><addtitle>EMCZUR</addtitle><description>In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design</description><subject>Crosstalk</subject><subject>Degradation</subject><subject>Dielectrics</subject><subject>Electronics packaging</subject><subject>Frequency</subject><subject>Impedance</subject><subject>Microstrip</subject><subject>Stripline</subject><subject>Transmission line discontinuities</subject><subject>Transmission lines</subject><isbn>9783952299036</isbn><isbn>3952299030</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8FKxDAYhAMiKGtfQC95gdYkbZLmuJa6CiuCuBcPLmnyp_211tLUw769AT3NDDMMfIRcc1Zwzsxt-9S8HV4KwZgqBJeMsTOSGV2XRgphDCvVBcli_EgFN0pXTF-S93YEty7o7EjtZMdTxJiMpx4i9hP9DtRjCLDAtGLazBaXSH8ieIoTHbAf8jhDSmHEOXcDzvRut00z92l7iFfkPNgxQvavG3K4b1-bh3z_vHtstvscOZNrLurahCBdEMLLuhTOlDX3WvqOB-3AdwnBqAQCygmoPXfCWCmYqqT2XQXlhtz8_SIAHOcFv-xyOnIljErcv1JgUxE</recordid><startdate>2006</startdate><enddate>2006</enddate><creator>Weiliang Yuan</creator><creator>Kuah Hsian Pang</creator><creator>Wang Chuen Khiang</creator><creator>Desmond Chong Yok Rue</creator><creator>Daengdora, M.A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2006</creationdate><title>Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages</title><author>Weiliang Yuan ; Kuah Hsian Pang ; Wang Chuen Khiang ; Desmond Chong Yok Rue ; Daengdora, M.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i105t-2889ff5cf22d5832c9381d75db1f7cedb39596839e6c2e8d1c29a5206457db4e3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Crosstalk</topic><topic>Degradation</topic><topic>Dielectrics</topic><topic>Electronics packaging</topic><topic>Frequency</topic><topic>Impedance</topic><topic>Microstrip</topic><topic>Stripline</topic><topic>Transmission line discontinuities</topic><topic>Transmission lines</topic><toplevel>online_resources</toplevel><creatorcontrib>Weiliang Yuan</creatorcontrib><creatorcontrib>Kuah Hsian Pang</creatorcontrib><creatorcontrib>Wang Chuen Khiang</creatorcontrib><creatorcontrib>Desmond Chong Yok Rue</creatorcontrib><creatorcontrib>Daengdora, M.A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Weiliang Yuan</au><au>Kuah Hsian Pang</au><au>Wang Chuen Khiang</au><au>Desmond Chong Yok Rue</au><au>Daengdora, M.A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages</atitle><btitle>2006 17th International Zurich Symposium on Electromagnetic Compatibility</btitle><stitle>EMCZUR</stitle><date>2006</date><risdate>2006</risdate><spage>578</spage><epage>581</epage><pages>578-581</pages><isbn>9783952299036</isbn><isbn>3952299030</isbn><abstract>In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design</abstract><pub>IEEE</pub><doi>10.1109/EMCZUR.2006.215000</doi><tpages>4</tpages></addata></record> |
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| ispartof | 2006 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, p.578-581 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Crosstalk Degradation Dielectrics Electronics packaging Frequency Impedance Microstrip Stripline Transmission line discontinuities Transmission lines |
| title | Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages |
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