Challenges in thermal interface material testing

Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lasance, Clemens J.M., Murray, Cameron T., Saums, David L., Rencz, Marta
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Conducting materials Contact resistance Electronic packaging thermal management Heat sinks Materials testing Resistance heating Semiconductor materials Thermal conductivity Thermal force Thermal resistance
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