Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications
We present a comparison of flip chip and wirebond first level interconnects used in a leadless plastic package with respect to high frequency performance. We apply numerical analysis and experimental measurements on high frequency devices. We show that flip chip interconnects provide superior electr...
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| creator | Engl, M. Pressel, K. Theuss, H. Dangelmaier, J. Eurskens, W. Knapp, H. Simbuerger, W. Weigel, R. |
| description | We present a comparison of flip chip and wirebond first level interconnects used in a leadless plastic package with respect to high frequency performance. We apply numerical analysis and experimental measurements on high frequency devices. We show that flip chip interconnects provide superior electrical performance compared to wirebonds. This is demonstrated by reduced losses and less parasitic effects |
| doi_str_mv | 10.1109/EPTC.2005.1614411 |
| format | Conference Proceeding |
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| identifier | ISBN: 0780395786 |
| ispartof | 2005 7th Electronic Packaging Technology Conference, 2005, Vol.1, p.5 pp. |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Contacts Copper Dielectric losses Dielectric substrates Electronics packaging Gold Plastic packaging Radio frequency Semiconductor device packaging |
| title | Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications |
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