Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)

Drop impact reliability assessment of solder joints on the chip scale packages is critical for use in miniature handheld products. Replacement of lead-based with lead-free solders requires the need of evaluating its compatibility with existing printed circuit board surface finishes. A 15 times 15mm...

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Bibliographische Detailangaben
Hauptverfasser: Chong, D.Y.R., Toh, H.J., Lim, B.K., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Luhua Xu
Format: Tagungsbericht
Sprache:eng
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