Digital image correlation and its applications in electronics packaging
This paper provides a review of digital image correlation method for in-plane displacement measurements, as well as the variants of digital image correlation algorithms. After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms...
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| creator | Sun Yaofeng Tan Yeow Meng Pang, J.H.L. Su Fei |
| description | This paper provides a review of digital image correlation method for in-plane displacement measurements, as well as the variants of digital image correlation algorithms. After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms could be divided into two groups according to the image analysis performed in the spatial domain or the spectral domain. The state of the art in both groups is described and a comparison between them is demonstrated in the paper. Digital image correlation method, as one of experimental mechanics techniques, is broadly applied to research and engineering. As an example, digital image correlation applications for thermomechanical property characterization and thermomechanical reliability in electronics packaging are demonstrated and discussed |
| doi_str_mv | 10.1109/EPTC.2005.1614380 |
| format | Conference Proceeding |
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After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms could be divided into two groups according to the image analysis performed in the spatial domain or the spectral domain. The state of the art in both groups is described and a comparison between them is demonstrated in the paper. Digital image correlation method, as one of experimental mechanics techniques, is broadly applied to research and engineering. As an example, digital image correlation applications for thermomechanical property characterization and thermomechanical reliability in electronics packaging are demonstrated and discussed</description><identifier>ISBN: 9780780395787</identifier><identifier>ISBN: 0780395786</identifier><identifier>DOI: 10.1109/EPTC.2005.1614380</identifier><language>eng</language><publisher>IEEE</publisher><subject>Application software ; Correlation ; Digital images ; Discrete Fourier transforms ; Displacement measurement ; Electronics packaging ; Fast Fourier transforms ; Photography ; Speckle ; Thermomechanical processes</subject><ispartof>2005 7th Electronic Packaging Technology Conference, 2005, Vol.1, p.6 pp.</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1614380$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1614380$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Sun Yaofeng</creatorcontrib><creatorcontrib>Tan Yeow Meng</creatorcontrib><creatorcontrib>Pang, J.H.L.</creatorcontrib><creatorcontrib>Su Fei</creatorcontrib><title>Digital image correlation and its applications in electronics packaging</title><title>2005 7th Electronic Packaging Technology Conference</title><addtitle>EPTC</addtitle><description>This paper provides a review of digital image correlation method for in-plane displacement measurements, as well as the variants of digital image correlation algorithms. After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms could be divided into two groups according to the image analysis performed in the spatial domain or the spectral domain. The state of the art in both groups is described and a comparison between them is demonstrated in the paper. Digital image correlation method, as one of experimental mechanics techniques, is broadly applied to research and engineering. As an example, digital image correlation applications for thermomechanical property characterization and thermomechanical reliability in electronics packaging are demonstrated and discussed</description><subject>Application software</subject><subject>Correlation</subject><subject>Digital images</subject><subject>Discrete Fourier transforms</subject><subject>Displacement measurement</subject><subject>Electronics packaging</subject><subject>Fast Fourier transforms</subject><subject>Photography</subject><subject>Speckle</subject><subject>Thermomechanical processes</subject><isbn>9780780395787</isbn><isbn>0780395786</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2005</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9jrEKwjAYhAMiKNoHEJf_BayJaWw716qjQ_cSYgy_xjQkWXx7i3T2ODj4Do4jZMNozhit9-2ta_IDpSJnR1bwis5IVpcVHc1rUVblgmQxPumoohBcFEtyOaHBJC3gWxoNaghBW5lwcCDdHTBFkN5bVD8WAR1oq1UKg0MVwUv1kgadWZP5Q9qosylXZHtuu-a6Q61178M4Hz79dIv_b78rOjx0</recordid><startdate>2005</startdate><enddate>2005</enddate><creator>Sun Yaofeng</creator><creator>Tan Yeow Meng</creator><creator>Pang, J.H.L.</creator><creator>Su Fei</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2005</creationdate><title>Digital image correlation and its applications in electronics packaging</title><author>Sun Yaofeng ; Tan Yeow Meng ; Pang, J.H.L. ; Su Fei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_16143803</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Application software</topic><topic>Correlation</topic><topic>Digital images</topic><topic>Discrete Fourier transforms</topic><topic>Displacement measurement</topic><topic>Electronics packaging</topic><topic>Fast Fourier transforms</topic><topic>Photography</topic><topic>Speckle</topic><topic>Thermomechanical processes</topic><toplevel>online_resources</toplevel><creatorcontrib>Sun Yaofeng</creatorcontrib><creatorcontrib>Tan Yeow Meng</creatorcontrib><creatorcontrib>Pang, J.H.L.</creatorcontrib><creatorcontrib>Su Fei</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sun Yaofeng</au><au>Tan Yeow Meng</au><au>Pang, J.H.L.</au><au>Su Fei</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Digital image correlation and its applications in electronics packaging</atitle><btitle>2005 7th Electronic Packaging Technology Conference</btitle><stitle>EPTC</stitle><date>2005</date><risdate>2005</risdate><volume>1</volume><spage>6 pp.</spage><pages>6 pp.-</pages><isbn>9780780395787</isbn><isbn>0780395786</isbn><abstract>This paper provides a review of digital image correlation method for in-plane displacement measurements, as well as the variants of digital image correlation algorithms. After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms could be divided into two groups according to the image analysis performed in the spatial domain or the spectral domain. The state of the art in both groups is described and a comparison between them is demonstrated in the paper. Digital image correlation method, as one of experimental mechanics techniques, is broadly applied to research and engineering. As an example, digital image correlation applications for thermomechanical property characterization and thermomechanical reliability in electronics packaging are demonstrated and discussed</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2005.1614380</doi></addata></record> |
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| identifier | ISBN: 9780780395787 |
| ispartof | 2005 7th Electronic Packaging Technology Conference, 2005, Vol.1, p.6 pp. |
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| language | eng |
| recordid | cdi_ieee_primary_1614380 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Application software Correlation Digital images Discrete Fourier transforms Displacement measurement Electronics packaging Fast Fourier transforms Photography Speckle Thermomechanical processes |
| title | Digital image correlation and its applications in electronics packaging |
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