Thermal design and analysis of output multiplexer for Ka-band satellite transponder

Heat transfer paths from irises, resonators, low path filters, and a manifold to the transponder panel are defined. Through comparison between results of "thermal contact conductance model" and "one body model", it has been confirmed that it is not necessary to consider the thermal contact resistances between parts assembled by bolts. And a quantitative evaluation of the effect of silver plating on temperature rise has been done. With assumptions of uniform heat dissipation within local regions and fixed temperature at the base plate, temperature distribution, heat flux density distribution, and self-heating are obtained. And it is shown that the median of the resonator's temperature rise distribution is identical to the average value. Finally it is shown that temperature distributions within resonators connected to a manifold is the same as those in resonators which stand independently.