Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging
The common approach to attaching a large number of fibers to a guided-wave device is to fabricate a linear array using V-grooves. UV-curable adhesives are used to attach the fiber in V-groove for the fabrication of fiber array. Interfacial delaminations at the adhesive fiber interfaces are common af...
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| Veröffentlicht in: | Journal of lightwave technology 2006-03, Vol.24 (3), p.1342-1349 |
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| container_title | Journal of lightwave technology |
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| creator | Uddin, M.A. Hau Ping Chan Tsun, T.O. Chan, Y.C. |
| description | The common approach to attaching a large number of fibers to a guided-wave device is to fabricate a linear array using V-grooves. UV-curable adhesives are used to attach the fiber in V-groove for the fabrication of fiber array. Interfacial delaminations at the adhesive fiber interfaces are common after the reliability test due to uneven curing of the UV adhesive. This paper investigated the causes of uneven curing that gave rise to delamination. An analytical ray tracing technique was used to estimate the variation in light intensity or shadowing during the UV curing of adhesive. These effects were found to be very severe when the refractive index difference between the adhesive and the cladding materials is very large. Based on this study, it can be concluded that the delamination problem can be minimized by selecting a UV-curable adhesive having the same refractive index of the cladding material. It is also recommended to light illuminate from the topside for fiber packaging |
| doi_str_mv | 10.1109/JLT.2005.863329 |
| format | Article |
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UV-curable adhesives are used to attach the fiber in V-groove for the fabrication of fiber array. Interfacial delaminations at the adhesive fiber interfaces are common after the reliability test due to uneven curing of the UV adhesive. This paper investigated the causes of uneven curing that gave rise to delamination. An analytical ray tracing technique was used to estimate the variation in light intensity or shadowing during the UV curing of adhesive. These effects were found to be very severe when the refractive index difference between the adhesive and the cladding materials is very large. Based on this study, it can be concluded that the delamination problem can be minimized by selecting a UV-curable adhesive having the same refractive index of the cladding material. It is also recommended to light illuminate from the topside for fiber packaging</description><identifier>ISSN: 0733-8724</identifier><identifier>EISSN: 1558-2213</identifier><identifier>DOI: 10.1109/JLT.2005.863329</identifier><identifier>CODEN: JLTEDG</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Adhesives ; Applied sciences ; Arrays ; Bonding ; Circuit properties ; Cladding ; Curing ; Delaminating ; Delamination ; Electric, optical and optoelectronic circuits ; Electronics ; Exact sciences and technology ; Fabrication ; fiber array ; Fibers ; Integrated optics. Optical fibers and wave guides ; Joining processes ; Materials selection ; Optical and optoelectronic circuits ; Optical fiber communications ; Optical fiber devices ; Optical fiber testing ; optical propagation ; Optical telecommunications ; Packaging ; Ray tracing ; Refractive index ; reliability ; Shadow mapping ; shadowing ; Telecommunications ; Telecommunications and information theory ; V-groove ; Vanadium</subject><ispartof>Journal of lightwave technology, 2006-03, Vol.24 (3), p.1342-1349</ispartof><rights>2006 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2006</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c414t-915d0a00799ce081baaf19998790d84dd19d7dd67747f850926363e0c460e04b3</citedby><cites>FETCH-LOGICAL-c414t-915d0a00799ce081baaf19998790d84dd19d7dd67747f850926363e0c460e04b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1605336$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1605336$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17595673$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Uddin, M.A.</creatorcontrib><creatorcontrib>Hau Ping Chan</creatorcontrib><creatorcontrib>Tsun, T.O.</creatorcontrib><creatorcontrib>Chan, Y.C.</creatorcontrib><title>Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging</title><title>Journal of lightwave technology</title><addtitle>JLT</addtitle><description>The common approach to attaching a large number of fibers to a guided-wave device is to fabricate a linear array using V-grooves. UV-curable adhesives are used to attach the fiber in V-groove for the fabrication of fiber array. Interfacial delaminations at the adhesive fiber interfaces are common after the reliability test due to uneven curing of the UV adhesive. This paper investigated the causes of uneven curing that gave rise to delamination. An analytical ray tracing technique was used to estimate the variation in light intensity or shadowing during the UV curing of adhesive. These effects were found to be very severe when the refractive index difference between the adhesive and the cladding materials is very large. Based on this study, it can be concluded that the delamination problem can be minimized by selecting a UV-curable adhesive having the same refractive index of the cladding material. It is also recommended to light illuminate from the topside for fiber packaging</description><subject>Adhesives</subject><subject>Applied sciences</subject><subject>Arrays</subject><subject>Bonding</subject><subject>Circuit properties</subject><subject>Cladding</subject><subject>Curing</subject><subject>Delaminating</subject><subject>Delamination</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fabrication</subject><subject>fiber array</subject><subject>Fibers</subject><subject>Integrated optics. Optical fibers and wave guides</subject><subject>Joining processes</subject><subject>Materials selection</subject><subject>Optical and optoelectronic circuits</subject><subject>Optical fiber communications</subject><subject>Optical fiber devices</subject><subject>Optical fiber testing</subject><subject>optical propagation</subject><subject>Optical telecommunications</subject><subject>Packaging</subject><subject>Ray tracing</subject><subject>Refractive index</subject><subject>reliability</subject><subject>Shadow mapping</subject><subject>shadowing</subject><subject>Telecommunications</subject><subject>Telecommunications and information theory</subject><subject>V-groove</subject><subject>Vanadium</subject><issn>0733-8724</issn><issn>1558-2213</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kTtvGzEQhA9BAkRxXKdIQwTIozl5SR5fpWHkZQhwY7k9UOSeTOdEKuSdAP9705EBAylcbcFvhrszTfOBwpJSMGeXq-slAxBLLTln5lWzoELoljHKXzcLUJy3WrHubfOulDsA2nVaLZqyjnjASNycQ9ySEP3s0Nc5YR6sC3YkHke7C9FOIUWSBrK-IdbfYgkHbDcp-ooPYYOZ2JztfZWSm3abUzogGVIm-9s0pRgc2Vv3x27rL--bN4MdC54-zZNm_eP79cWvdnX18_fF-ap1He2m1lDhwQIoYxyCphtrB2qM0cqA15331HjlvVSqU4MWYJjkkiO4TgJCt-Enzdej7z6nvzOWqd-F4nAcbcQ0l14bWQOjilXyy4sk0yBqXLyC314EKTCmjanLVPTTf-hdmnOsB_daSqBMAFTo7Ai5nErJOPT7HHY231en_rHWvtbaP9baH2utis9PtrY4Ow7ZRhfKs0wJI-S_TT8euYCIz88SBK8pPQA8HKnK</recordid><startdate>20060301</startdate><enddate>20060301</enddate><creator>Uddin, M.A.</creator><creator>Hau Ping Chan</creator><creator>Tsun, T.O.</creator><creator>Chan, Y.C.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20060301</creationdate><title>Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging</title><author>Uddin, M.A. ; Hau Ping Chan ; Tsun, T.O. ; Chan, Y.C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c414t-915d0a00799ce081baaf19998790d84dd19d7dd67747f850926363e0c460e04b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Adhesives</topic><topic>Applied sciences</topic><topic>Arrays</topic><topic>Bonding</topic><topic>Circuit properties</topic><topic>Cladding</topic><topic>Curing</topic><topic>Delaminating</topic><topic>Delamination</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fabrication</topic><topic>fiber array</topic><topic>Fibers</topic><topic>Integrated optics. Optical fibers and wave guides</topic><topic>Joining processes</topic><topic>Materials selection</topic><topic>Optical and optoelectronic circuits</topic><topic>Optical fiber communications</topic><topic>Optical fiber devices</topic><topic>Optical fiber testing</topic><topic>optical propagation</topic><topic>Optical telecommunications</topic><topic>Packaging</topic><topic>Ray tracing</topic><topic>Refractive index</topic><topic>reliability</topic><topic>Shadow mapping</topic><topic>shadowing</topic><topic>Telecommunications</topic><topic>Telecommunications and information theory</topic><topic>V-groove</topic><topic>Vanadium</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Uddin, M.A.</creatorcontrib><creatorcontrib>Hau Ping Chan</creatorcontrib><creatorcontrib>Tsun, T.O.</creatorcontrib><creatorcontrib>Chan, Y.C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of lightwave technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Uddin, M.A.</au><au>Hau Ping Chan</au><au>Tsun, T.O.</au><au>Chan, Y.C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging</atitle><jtitle>Journal of lightwave technology</jtitle><stitle>JLT</stitle><date>2006-03-01</date><risdate>2006</risdate><volume>24</volume><issue>3</issue><spage>1342</spage><epage>1349</epage><pages>1342-1349</pages><issn>0733-8724</issn><eissn>1558-2213</eissn><coden>JLTEDG</coden><abstract>The common approach to attaching a large number of fibers to a guided-wave device is to fabricate a linear array using V-grooves. UV-curable adhesives are used to attach the fiber in V-groove for the fabrication of fiber array. Interfacial delaminations at the adhesive fiber interfaces are common after the reliability test due to uneven curing of the UV adhesive. This paper investigated the causes of uneven curing that gave rise to delamination. An analytical ray tracing technique was used to estimate the variation in light intensity or shadowing during the UV curing of adhesive. These effects were found to be very severe when the refractive index difference between the adhesive and the cladding materials is very large. Based on this study, it can be concluded that the delamination problem can be minimized by selecting a UV-curable adhesive having the same refractive index of the cladding material. It is also recommended to light illuminate from the topside for fiber packaging</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/JLT.2005.863329</doi><tpages>8</tpages></addata></record> |
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| subjects | Adhesives Applied sciences Arrays Bonding Circuit properties Cladding Curing Delaminating Delamination Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Fabrication fiber array Fibers Integrated optics. Optical fibers and wave guides Joining processes Materials selection Optical and optoelectronic circuits Optical fiber communications Optical fiber devices Optical fiber testing optical propagation Optical telecommunications Packaging Ray tracing Refractive index reliability Shadow mapping shadowing Telecommunications Telecommunications and information theory V-groove Vanadium |
| title | Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging |
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