Device interconnection technology for advanced thermal conduction modules
The use of area array solder bumps on silicon devices known as controlled collapse chip connection (C4) balls for terminating logic and memory devices to ceramic substrates has been extended in both interconnection density and total number of chip I/O connections per module. In addition, a novel mat...
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| Veröffentlicht in: | IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1992-08, Vol.15 (4), p.432-437 |
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| container_end_page | 437 |
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| container_issue | 4 |
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| container_title | IEEE transactions on components, hybrids, and manufacturing technology |
| container_volume | 15 |
| creator | Ray, S.K. Beckham, K.F. Master, R.N. |
| description | The use of area array solder bumps on silicon devices known as controlled collapse chip connection (C4) balls for terminating logic and memory devices to ceramic substrates has been extended in both interconnection density and total number of chip I/O connections per module. In addition, a novel materials set, namely glass-ceramic with copper internal metallization along with thin film redistribution wiring on the top surface, has been introduced for multilayered ceramic substrates. Key elements of advanced glass-ceramic substrate technology relevant to flip-chip joining are reviewed. This is followed by a discussion of device join and replace processes used in advanced thermal conduction modules (ATCMs). These models have decoupling capacitors which are attached by C4 solder reflow. Optimization of the top surface metallurgy and device join parameters necessary to achieve reliable joining of more than 70,000 solder balls per module is discussed.< > |
| doi_str_mv | 10.1109/33.159870 |
| format | Article |
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In addition, a novel materials set, namely glass-ceramic with copper internal metallization along with thin film redistribution wiring on the top surface, has been introduced for multilayered ceramic substrates. Key elements of advanced glass-ceramic substrate technology relevant to flip-chip joining are reviewed. This is followed by a discussion of device join and replace processes used in advanced thermal conduction modules (ATCMs). These models have decoupling capacitors which are attached by C4 solder reflow. 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In addition, a novel materials set, namely glass-ceramic with copper internal metallization along with thin film redistribution wiring on the top surface, has been introduced for multilayered ceramic substrates. Key elements of advanced glass-ceramic substrate technology relevant to flip-chip joining are reviewed. This is followed by a discussion of device join and replace processes used in advanced thermal conduction modules (ATCMs). These models have decoupling capacitors which are attached by C4 solder reflow. Optimization of the top surface metallurgy and device join parameters necessary to achieve reliable joining of more than 70,000 solder balls per module is discussed.< ></description><subject>Applied sciences</subject><subject>Ceramics</subject><subject>Conducting materials</subject><subject>Copper</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Inorganic materials</subject><subject>Integrated circuits</subject><subject>Logic arrays</subject><subject>Logic devices</subject><subject>Metallization</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Inorganic materials</topic><topic>Integrated circuits</topic><topic>Logic arrays</topic><topic>Logic devices</topic><topic>Metallization</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. 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| identifier | ISSN: 0148-6411 |
| ispartof | IEEE transactions on components, hybrids, and manufacturing technology, 1992-08, Vol.15 (4), p.432-437 |
| issn | 0148-6411 1558-3082 |
| language | eng |
| recordid | cdi_ieee_primary_159870 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Ceramics Conducting materials Copper Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Inorganic materials Integrated circuits Logic arrays Logic devices Metallization Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon devices Substrates Thermal conductivity |
| title | Device interconnection technology for advanced thermal conduction modules |
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