The application of RSM in optimization of the curing profile for electronic packaging polymers

Process-induced warpage is a major concern for the electronic packages. In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and min...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fuhong Huang, Yubing Gong, Quanyong Li, Daoguo Yang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Curing Electronic packaging thermal management Electronics cooling Electronics packaging Flip chip Numerical simulation Optimization methods Polymers Temperature dependence
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