The application of RSM in optimization of the curing profile for electronic packaging polymers

Process-induced warpage is a major concern for the electronic packages. In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and min...

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Hauptverfasser:	Fuhong Huang, Yubing Gong, Quanyong Li, Daoguo Yang
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Curing Electronic packaging thermal management Electronics cooling Electronics packaging Flip chip Numerical simulation Optimization methods Polymers Temperature dependence
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creator	Fuhong Huang Yubing Gong Quanyong Li Daoguo Yang
description	Process-induced warpage is a major concern for the electronic packages. In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and minimize the warpage. A plane strain FEM model is established to simulate the thermal-mechanical characters of flip chip package. Anand mode and Maxwell mode are adopted to describe the time and temperature dependent material properties for eutectic solder joints and epoxy underfill, respectively. Based on the simulation result, response surface method (RSM) and constrained variable metric method(CVM) are employed to find optimal curing profile for underfill in flip chip packaging. The simulation results show that package warpage can be effectively reduced by choosing optimal curing profile.
doi_str_mv	10.1109/ICEPT.2005.1564638
format	Conference Proceeding
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In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and minimize the warpage. A plane strain FEM model is established to simulate the thermal-mechanical characters of flip chip package. Anand mode and Maxwell mode are adopted to describe the time and temperature dependent material properties for eutectic solder joints and epoxy underfill, respectively. Based on the simulation result, response surface method (RSM) and constrained variable metric method(CVM) are employed to find optimal curing profile for underfill in flip chip packaging. 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The simulation results show that package warpage can be effectively reduced by choosing optimal curing profile.</description><subject>Capacitive sensors</subject><subject>Curing</subject><subject>Electronic packaging thermal management</subject><subject>Electronics cooling</subject><subject>Electronics packaging</subject><subject>Flip chip</subject><subject>Numerical simulation</subject><subject>Optimization methods</subject><subject>Polymers</subject><subject>Temperature dependence</subject><isbn>9780780394490</isbn><isbn>0780394496</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2005</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9kNFKxDAQRQMiKGt_QF_yA62ZNmmTRymrLqwo2meXNJ2u0bYJaX1Yv96wLg4X5jIcLpch5BpYBsDU7aZevzRZzpjIQJS8LOQZSVQlWVShOFfsgiTz_MnicFFUkl-S9-YDqfZ-sEYv1k3U9fT17Yna6PxiR_vzf14iab6DnfbUB9fbAWnvAsUBzRLcZA312nzp_RFww2HEMF-R814PMyanvSLN_bqpH9Pt88OmvtumVrElbU2uqlIjgBQltCAltNK0XawoZAeCdzLnqBCxNMbE5iCQG9m1FeujwWJFbv5ibWR2PthRh8Pu9ITiF1ZrVCQ</recordid><startdate>2005</startdate><enddate>2005</enddate><creator>Fuhong Huang</creator><creator>Yubing Gong</creator><creator>Quanyong Li</creator><creator>Daoguo Yang</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2005</creationdate><title>The application of RSM in optimization of the curing profile for electronic packaging polymers</title><author>Fuhong Huang ; Yubing Gong ; Quanyong Li ; Daoguo Yang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-bc2976ae118561b1881b8cbd37858d154d824e9eee6ccc53715e4c8db70fe4ce3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Capacitive sensors</topic><topic>Curing</topic><topic>Electronic packaging thermal management</topic><topic>Electronics cooling</topic><topic>Electronics packaging</topic><topic>Flip chip</topic><topic>Numerical simulation</topic><topic>Optimization methods</topic><topic>Polymers</topic><topic>Temperature dependence</topic><toplevel>online_resources</toplevel><creatorcontrib>Fuhong Huang</creatorcontrib><creatorcontrib>Yubing Gong</creatorcontrib><creatorcontrib>Quanyong Li</creatorcontrib><creatorcontrib>Daoguo Yang</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fuhong Huang</au><au>Yubing Gong</au><au>Quanyong Li</au><au>Daoguo Yang</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The application of RSM in optimization of the curing profile for electronic packaging polymers</atitle><btitle>2005 6th International Conference on Electronic Packaging Technology</btitle><stitle>ICEPT</stitle><date>2005</date><risdate>2005</risdate><spage>221</spage><epage>225</epage><pages>221-225</pages><isbn>9780780394490</isbn><isbn>0780394496</isbn><abstract>Process-induced warpage is a major concern for the electronic packages. In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and minimize the warpage. A plane strain FEM model is established to simulate the thermal-mechanical characters of flip chip package. Anand mode and Maxwell mode are adopted to describe the time and temperature dependent material properties for eutectic solder joints and epoxy underfill, respectively. Based on the simulation result, response surface method (RSM) and constrained variable metric method(CVM) are employed to find optimal curing profile for underfill in flip chip packaging. The simulation results show that package warpage can be effectively reduced by choosing optimal curing profile.</abstract><pub>IEEE</pub><doi>10.1109/ICEPT.2005.1564638</doi><tpages>5</tpages></addata></record>
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identifier	ISBN: 9780780394490
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Capacitive sensors Curing Electronic packaging thermal management Electronics cooling Electronics packaging Flip chip Numerical simulation Optimization methods Polymers Temperature dependence
title	The application of RSM in optimization of the curing profile for electronic packaging polymers
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