Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments

This study characterizes a low expansion PCB composed of STABLCORreg/FR4 laminate that is suitable for flip-chip applications exposed to extreme operating environments from -55degC to +150degC. We demonstrate that the STABLCORreg/FR4 laminate exhibits approximately 80% reduction in CTE and greater s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Scott Copeland, D., Kaysar Rahim, M., Saiful Islam, M., Suhling, J.C., Jaeger, R.C., Lall, P., Tianb, G., Vasoya, K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Flammability Laminates Piezoresistance Semiconductor device measurement Sensor phenomena and characterization Silicon Stress measurement Testing Thermal stability
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