Thermal analytical model for analysis of pulsed DC electromigration results
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creator | Waltz, P. Lormand, G. Arnaud, L. |
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doi_str_mv | 10.1109/ESSDERC.1997.194471 |
format | Conference Proceeding |
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Lormand, G. ; Arnaud, L.</creator><creatorcontrib>Waltz, P. ; Lormand, G. ; Arnaud, L.</creatorcontrib><identifier>ISBN: 2863322214</identifier><identifier>ISBN: 9782863322215</identifier><identifier>DOI: 10.1109/ESSDERC.1997.194471</identifier><language>eng</language><publisher>Editions Frontieres</publisher><subject>Analytical models ; Electromigration ; Equations ; Frequency ; Heating ; Power system modeling ; Temperature ; Testing ; Thermal resistance ; Thermal stresses</subject><ispartof>27th European Solid-State Device Research Conference, 1997, p.484-487</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1503401$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1503401$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Waltz, P.</creatorcontrib><creatorcontrib>Lormand, G.</creatorcontrib><creatorcontrib>Arnaud, L.</creatorcontrib><title>Thermal analytical model for analysis of pulsed DC electromigration results</title><title>27th European Solid-State Device Research Conference</title><addtitle>ESSDERC</addtitle><subject>Analytical models</subject><subject>Electromigration</subject><subject>Equations</subject><subject>Frequency</subject><subject>Heating</subject><subject>Power system modeling</subject><subject>Temperature</subject><subject>Testing</subject><subject>Thermal resistance</subject><subject>Thermal stresses</subject><isbn>2863322214</isbn><isbn>9782863322215</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1997</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjMtqwzAURAWl0DbNF2SjH3B6ryRL1rI47oMGCo33QZGvWhU7DpKzyN_XkG5mDsNhGFshrBHBPjW73ab5qtdorZlDKYM37EFUWkohBKo7tsz5FwDQ6kqDvWcf7Q-lwfXcHV1_maKfcRg76nkY03XMMfMx8NO5z9TxTc2pJz-lcYjfyU1xPPJE-dxP-ZHdBjdLy_9esPalaeu3Yvv5-l4_b4toYSqCDocATkuyVgtvAoDvhCNfVgqqUpBAY6zuLJYqUCWl88qQkeRQHDyiXLDV9TYS0f6U4uDSZY8lSAUo_wBmzUyX</recordid><startdate>1997</startdate><enddate>1997</enddate><creator>Waltz, P.</creator><creator>Lormand, G.</creator><creator>Arnaud, L.</creator><general>Editions Frontieres</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1997</creationdate><title>Thermal analytical model for analysis of pulsed DC electromigration results</title><author>Waltz, P. ; 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identifier | ISBN: 2863322214 |
ispartof | 27th European Solid-State Device Research Conference, 1997, p.484-487 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Analytical models Electromigration Equations Frequency Heating Power system modeling Temperature Testing Thermal resistance Thermal stresses |
title | Thermal analytical model for analysis of pulsed DC electromigration results |
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