Pressure sensor development using hard anodized aluminum diaphragm and sputtered Pt-W thin film strain sensors
Pressure sensors with a metallic diaphragm and bonded strain gauge are by far the most widely used sensors in pressure measurement. In this work, we describe a method to fabricate a low power, light weight and low cost pressure sensor using aluminum diaphragm. The diaphragm is hard anodized to get i...
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| creator | Raiendra, A. Parmar, B.J. Sharma, A.K. Bhojraj, H. Nayak, M.M. Rajanna, K. |
| description | Pressure sensors with a metallic diaphragm and bonded strain gauge are by far the most widely used sensors in pressure measurement. In this work, we describe a method to fabricate a low power, light weight and low cost pressure sensor using aluminum diaphragm. The diaphragm is hard anodized to get insulating base over which Pt-W (Pt: 92%, W: 8%) thin film strain sensors are sputter deposited for sensing the pressure. Hence, this technique eliminates the application of adhesive to bond the strain gauges to the metallic diaphragm. The required level of insulation resistance (in the range of giga-ohms) between the metal diaphragm and the sputtered stain gauge is provided by the hard anodic film. The hard anodic coating is obtained by the wet electrochemical method with pulsed power supply arrangement. The details of diaphragm fabrication, hard anodization of aluminum, testing, calibration of sensor and its applications are discussed and compared with sensors fabricated from different aluminum alloys (AA2024, AA6061 and AA7075). |
| doi_str_mv | 10.1109/SENSOR.2005.1497327 |
| format | Conference Proceeding |
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In this work, we describe a method to fabricate a low power, light weight and low cost pressure sensor using aluminum diaphragm. The diaphragm is hard anodized to get insulating base over which Pt-W (Pt: 92%, W: 8%) thin film strain sensors are sputter deposited for sensing the pressure. Hence, this technique eliminates the application of adhesive to bond the strain gauges to the metallic diaphragm. The required level of insulation resistance (in the range of giga-ohms) between the metal diaphragm and the sputtered stain gauge is provided by the hard anodic film. The hard anodic coating is obtained by the wet electrochemical method with pulsed power supply arrangement. 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The details of diaphragm fabrication, hard anodization of aluminum, testing, calibration of sensor and its applications are discussed and compared with sensors fabricated from different aluminum alloys (AA2024, AA6061 and AA7075).</description><subject>Aluminum</subject><subject>Bonding</subject><subject>Capacitive sensors</subject><subject>Costs</subject><subject>Insulation</subject><subject>Pressure measurement</subject><subject>Pulsed power supplies</subject><subject>Sputtering</subject><subject>Strain measurement</subject><subject>Thin film sensors</subject><issn>2159-547X</issn><isbn>0780389948</isbn><isbn>9780780389946</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2005</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkNFKwzAYhQMqOOeeYDd5gc4_TdI2lzKmDoYbTtG7kax_10ibliQV9OktbOfmHDiH7-IQMmewYAzUw371ut--LVIAuWBC5TzNr8gd5AXwQilRXJNJyqRKpMi_bskshG8YxVUmVTEhbucxhMEjDehC52mJP9h0fYsu0iFYd6K19iXVrivtH46hGVrrhpaWVve116d27Eoa-iFG9ONgF5NPGmvraGWblobo9ZjP9HBPbirdBJxdfEo-nlbvy5dks31eLx83iWW5jIk0Uh4NploYpVAYo0VlCgGgEDgYLjKRopQyk0wbACOkQBQqO2ZVkfMs5VMyP3MtIh56b1vtfw-Xe_g_2nZb-A</recordid><startdate>2005</startdate><enddate>2005</enddate><creator>Raiendra, A.</creator><creator>Parmar, B.J.</creator><creator>Sharma, A.K.</creator><creator>Bhojraj, H.</creator><creator>Nayak, M.M.</creator><creator>Rajanna, K.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2005</creationdate><title>Pressure sensor development using hard anodized aluminum diaphragm and sputtered Pt-W thin film strain sensors</title><author>Raiendra, A. ; Parmar, B.J. ; Sharma, A.K. ; Bhojraj, H. ; Nayak, M.M. ; Rajanna, K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-5b55cbe2a4b99e4bba4fb84009e030b34642e555651ab00b454ee496c6f873623</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Aluminum</topic><topic>Bonding</topic><topic>Capacitive sensors</topic><topic>Costs</topic><topic>Insulation</topic><topic>Pressure measurement</topic><topic>Pulsed power supplies</topic><topic>Sputtering</topic><topic>Strain measurement</topic><topic>Thin film sensors</topic><toplevel>online_resources</toplevel><creatorcontrib>Raiendra, A.</creatorcontrib><creatorcontrib>Parmar, B.J.</creatorcontrib><creatorcontrib>Sharma, A.K.</creatorcontrib><creatorcontrib>Bhojraj, H.</creatorcontrib><creatorcontrib>Nayak, M.M.</creatorcontrib><creatorcontrib>Rajanna, K.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Raiendra, A.</au><au>Parmar, B.J.</au><au>Sharma, A.K.</au><au>Bhojraj, H.</au><au>Nayak, M.M.</au><au>Rajanna, K.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Pressure sensor development using hard anodized aluminum diaphragm and sputtered Pt-W thin film strain sensors</atitle><btitle>The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05</btitle><stitle>SENSOR</stitle><date>2005</date><risdate>2005</risdate><volume>2</volume><spage>1334</spage><epage>1337 Vol. 2</epage><pages>1334-1337 Vol. 2</pages><issn>2159-547X</issn><isbn>0780389948</isbn><isbn>9780780389946</isbn><abstract>Pressure sensors with a metallic diaphragm and bonded strain gauge are by far the most widely used sensors in pressure measurement. In this work, we describe a method to fabricate a low power, light weight and low cost pressure sensor using aluminum diaphragm. The diaphragm is hard anodized to get insulating base over which Pt-W (Pt: 92%, W: 8%) thin film strain sensors are sputter deposited for sensing the pressure. Hence, this technique eliminates the application of adhesive to bond the strain gauges to the metallic diaphragm. The required level of insulation resistance (in the range of giga-ohms) between the metal diaphragm and the sputtered stain gauge is provided by the hard anodic film. The hard anodic coating is obtained by the wet electrochemical method with pulsed power supply arrangement. The details of diaphragm fabrication, hard anodization of aluminum, testing, calibration of sensor and its applications are discussed and compared with sensors fabricated from different aluminum alloys (AA2024, AA6061 and AA7075).</abstract><pub>IEEE</pub><doi>10.1109/SENSOR.2005.1497327</doi></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2159-547X |
| ispartof | The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05, 2005, Vol.2, p.1334-1337 Vol. 2 |
| issn | 2159-547X |
| language | eng |
| recordid | cdi_ieee_primary_1497327 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aluminum Bonding Capacitive sensors Costs Insulation Pressure measurement Pulsed power supplies Sputtering Strain measurement Thin film sensors |
| title | Pressure sensor development using hard anodized aluminum diaphragm and sputtered Pt-W thin film strain sensors |
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