Testing of packaging materials for improved PV module reliability
A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat...
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| creator | Jorgensen, G.J. Terwilliger, K.M. Kempe, M.D. McMahon, T.J. |
| description | A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85/spl deg/C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated. |
| doi_str_mv | 10.1109/PVSC.2005.1488179 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1488179</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1488179</ieee_id><sourcerecordid>1488179</sourcerecordid><originalsourceid>FETCH-LOGICAL-c294t-bc6699807234358d26a6156156b8e3405ad4db5bd07c2733669d67d81d9e6a6d3</originalsourceid><addsrcrecordid>eNotkFFLwzAUhQMqOGZ_gPgS8Lk1aZImeRxFnTBw4NxrSZPbGW2b0lZh_96M7XLgcuHjcM5F6J6SjFKin7b7jzLLCREZ5UpRqa9QoqUiUUxJIvNrtCC0IKlikt6iZJq-SRwumNRigVY7mGbfH3Bo8GDsjzmcjs7MMHrTTrgJI_bdMIY_cHi7x11wvy3gEVpvat_6-XiHbppIQnLZS_T58rwr1-nm_fWtXG1Sm2s-p7UtCq1jrpxxJpTLC1NQcVKtgHEijOOuFrUj0uaSsUi7QjpFnYaIOrZEj2ffEANXk_Uz2C8b-h7sXFEROzJNI_VwpjwAVMPoOzMeq8tr2D-2N1W_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Testing of packaging materials for improved PV module reliability</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jorgensen, G.J. ; Terwilliger, K.M. ; Kempe, M.D. ; McMahon, T.J.</creator><creatorcontrib>Jorgensen, G.J. ; Terwilliger, K.M. ; Kempe, M.D. ; McMahon, T.J. ; National Renewable Energy Lab., Golden, CO (US)</creatorcontrib><description>A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85/spl deg/C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.</description><identifier>ISSN: 0160-8371</identifier><identifier>ISBN: 9780780387072</identifier><identifier>ISBN: 0780387074</identifier><identifier>DOI: 10.1109/PVSC.2005.1488179</identifier><language>eng</language><publisher>United States: IEEE</publisher><subject>ADHESION ; Adhesives ; Building materials ; Corrosion ; ENCAPSULANT ; ENGINEERING ; Glass ; HUMIDITY ; Materials reliability ; Materials testing ; MODULE RELIABILITY ; MOISTURE ; MOISTURE INGRESS PROTECTION ; Moisture measurement ; PACKAGING ; PACKAGING APPLICATIONS ; Protection ; PV ; RELIABILITY ; SOFT BACKSHEET MATERIALS ; SOLAR ENERGY ; SOLAR ENERGY - PHOTOVOLTAICS ; Sputtering ; TESTING ; TRANSPORT</subject><ispartof>Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005, 2005, p.499-502</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c294t-bc6699807234358d26a6156156b8e3405ad4db5bd07c2733669d67d81d9e6a6d3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1488179$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>230,310,311,781,785,790,791,886,2059,4051,4052,27930,54925</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1488179$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttps://www.osti.gov/servlets/purl/15016391$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Jorgensen, G.J.</creatorcontrib><creatorcontrib>Terwilliger, K.M.</creatorcontrib><creatorcontrib>Kempe, M.D.</creatorcontrib><creatorcontrib>McMahon, T.J.</creatorcontrib><creatorcontrib>National Renewable Energy Lab., Golden, CO (US)</creatorcontrib><title>Testing of packaging materials for improved PV module reliability</title><title>Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005</title><addtitle>PVSC</addtitle><description>A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85/spl deg/C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.</description><subject>ADHESION</subject><subject>Adhesives</subject><subject>Building materials</subject><subject>Corrosion</subject><subject>ENCAPSULANT</subject><subject>ENGINEERING</subject><subject>Glass</subject><subject>HUMIDITY</subject><subject>Materials reliability</subject><subject>Materials testing</subject><subject>MODULE RELIABILITY</subject><subject>MOISTURE</subject><subject>MOISTURE INGRESS PROTECTION</subject><subject>Moisture measurement</subject><subject>PACKAGING</subject><subject>PACKAGING APPLICATIONS</subject><subject>Protection</subject><subject>PV</subject><subject>RELIABILITY</subject><subject>SOFT BACKSHEET MATERIALS</subject><subject>SOLAR ENERGY</subject><subject>SOLAR ENERGY - PHOTOVOLTAICS</subject><subject>Sputtering</subject><subject>TESTING</subject><subject>TRANSPORT</subject><issn>0160-8371</issn><isbn>9780780387072</isbn><isbn>0780387074</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2005</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkFFLwzAUhQMqOGZ_gPgS8Lk1aZImeRxFnTBw4NxrSZPbGW2b0lZh_96M7XLgcuHjcM5F6J6SjFKin7b7jzLLCREZ5UpRqa9QoqUiUUxJIvNrtCC0IKlikt6iZJq-SRwumNRigVY7mGbfH3Bo8GDsjzmcjs7MMHrTTrgJI_bdMIY_cHi7x11wvy3gEVpvat_6-XiHbppIQnLZS_T58rwr1-nm_fWtXG1Sm2s-p7UtCq1jrpxxJpTLC1NQcVKtgHEijOOuFrUj0uaSsUi7QjpFnYaIOrZEj2ffEANXk_Uz2C8b-h7sXFEROzJNI_VwpjwAVMPoOzMeq8tr2D-2N1W_</recordid><startdate>2005</startdate><enddate>2005</enddate><creator>Jorgensen, G.J.</creator><creator>Terwilliger, K.M.</creator><creator>Kempe, M.D.</creator><creator>McMahon, T.J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>OIOZB</scope><scope>OTOTI</scope></search><sort><creationdate>2005</creationdate><title>Testing of packaging materials for improved PV module reliability</title><author>Jorgensen, G.J. ; Terwilliger, K.M. ; Kempe, M.D. ; McMahon, T.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c294t-bc6699807234358d26a6156156b8e3405ad4db5bd07c2733669d67d81d9e6a6d3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2005</creationdate><topic>ADHESION</topic><topic>Adhesives</topic><topic>Building materials</topic><topic>Corrosion</topic><topic>ENCAPSULANT</topic><topic>ENGINEERING</topic><topic>Glass</topic><topic>HUMIDITY</topic><topic>Materials reliability</topic><topic>Materials testing</topic><topic>MODULE RELIABILITY</topic><topic>MOISTURE</topic><topic>MOISTURE INGRESS PROTECTION</topic><topic>Moisture measurement</topic><topic>PACKAGING</topic><topic>PACKAGING APPLICATIONS</topic><topic>Protection</topic><topic>PV</topic><topic>RELIABILITY</topic><topic>SOFT BACKSHEET MATERIALS</topic><topic>SOLAR ENERGY</topic><topic>SOLAR ENERGY - PHOTOVOLTAICS</topic><topic>Sputtering</topic><topic>TESTING</topic><topic>TRANSPORT</topic><toplevel>online_resources</toplevel><creatorcontrib>Jorgensen, G.J.</creatorcontrib><creatorcontrib>Terwilliger, K.M.</creatorcontrib><creatorcontrib>Kempe, M.D.</creatorcontrib><creatorcontrib>McMahon, T.J.</creatorcontrib><creatorcontrib>National Renewable Energy Lab., Golden, CO (US)</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>OSTI.GOV - Hybrid</collection><collection>OSTI.GOV</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jorgensen, G.J.</au><au>Terwilliger, K.M.</au><au>Kempe, M.D.</au><au>McMahon, T.J.</au><aucorp>National Renewable Energy Lab., Golden, CO (US)</aucorp><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Testing of packaging materials for improved PV module reliability</atitle><btitle>Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005</btitle><stitle>PVSC</stitle><date>2005</date><risdate>2005</risdate><spage>499</spage><epage>502</epage><pages>499-502</pages><issn>0160-8371</issn><isbn>9780780387072</isbn><isbn>0780387074</isbn><abstract>A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85/spl deg/C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.</abstract><cop>United States</cop><pub>IEEE</pub><doi>10.1109/PVSC.2005.1488179</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0160-8371 |
| ispartof | Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005, 2005, p.499-502 |
| issn | 0160-8371 |
| language | eng |
| recordid | cdi_ieee_primary_1488179 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | ADHESION Adhesives Building materials Corrosion ENCAPSULANT ENGINEERING Glass HUMIDITY Materials reliability Materials testing MODULE RELIABILITY MOISTURE MOISTURE INGRESS PROTECTION Moisture measurement PACKAGING PACKAGING APPLICATIONS Protection PV RELIABILITY SOFT BACKSHEET MATERIALS SOLAR ENERGY SOLAR ENERGY - PHOTOVOLTAICS Sputtering TESTING TRANSPORT |
| title | Testing of packaging materials for improved PV module reliability |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-12T16%3A26%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Testing%20of%20packaging%20materials%20for%20improved%20PV%20module%20reliability&rft.btitle=Conference%20Record%20of%20the%20Thirty-first%20IEEE%20Photovoltaic%20Specialists%20Conference,%202005&rft.au=Jorgensen,%20G.J.&rft.aucorp=National%20Renewable%20Energy%20Lab.,%20Golden,%20CO%20(US)&rft.date=2005&rft.spage=499&rft.epage=502&rft.pages=499-502&rft.issn=0160-8371&rft.isbn=9780780387072&rft.isbn_list=0780387074&rft_id=info:doi/10.1109/PVSC.2005.1488179&rft_dat=%3Cieee_6IE%3E1488179%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1488179&rfr_iscdi=true |