Fracture mechanics life prediction for microscale components, with application to wire bonding

Experimental and analytical results on the lifetime of 25 mu m diameter aluminum 1% silicon wire bonds subject to on/off current cycling are presented, along with related scanning electron microscopy of the heel area of the bond. The analytical results utilize a steady-state temperature solution for...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Harris, D.O., Sire, R.A., Popelar, C.F., Kanninen, M.F., Davidson, D.L., Duncan, L.B., Kallis, J.M., Buechler, D.W., Backes, P.G., Reizman, F.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Fatigue Finite element methods Material properties Scanning electron microscopy Silicon Steady-state Stress Temperature Wire
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!