Full-chip implementation of IDEALsmile on 90nm node devices with ArF lithography

Summary form only given. According to sizes dictated by ITRS roadmap, contact holes are one of the most challenging features to be printed in the semiconductor manufacturing process. To overcome this issue Canon, in 2002, introduced a new technology, entitled lDEALSmile1i2 (Innovative Double Effecti...

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Bibliographische Detailangaben

Hauptverfasser:	Yamazoe, K., Pepe, A., Kuno, T., Suzuki, A., Saitoh, K., Cantu, P., Capetti, G., Evangelista, E., Hasegawa, Y., Iwasa, J., Toublan, O., Loi, S., Lupo, M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Cost function Graphics Interference Lighting Lithography Manufacturing processes Optimized production technology Throughput
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